PIC24HJ128GP210-E/PF Microchip Technology, PIC24HJ128GP210-E/PF Datasheet - Page 272
![IC PIC MCU FLASH 64KX16 100TQFP](/photos/12/13/121330/c04-100-tqfp_sml.jpg)
PIC24HJ128GP210-E/PF
Manufacturer Part Number
PIC24HJ128GP210-E/PF
Description
IC PIC MCU FLASH 64KX16 100TQFP
Manufacturer
Microchip Technology
Series
PIC® 24Hr
Datasheets
1.PIC24HJ12GP201-ISO.pdf
(84 pages)
2.PIC24HJ64GP206-IPT.pdf
(292 pages)
3.PIC24HJ64GP206-IPT.pdf
(8 pages)
4.PIC24HJ64GP206-IPT.pdf
(20 pages)
5.PIC24HJ64GP206-IPT.pdf
(26 pages)
Specifications of PIC24HJ128GP210-E/PF
Core Processor
PIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, POR, PWM, WDT
Number Of I /o
85
Program Memory Size
128KB (43K x 24)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
100-TQFP, 100-VQFP
For Use With
DM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32AC164323 - MODULE SKT FOR 100TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
- PIC24HJ12GP201-ISO PDF datasheet
- PIC24HJ64GP206-IPT PDF datasheet #2
- PIC24HJ64GP206-IPT PDF datasheet #3
- PIC24HJ64GP206-IPT PDF datasheet #4
- PIC24HJ64GP206-IPT PDF datasheet #5
- Current page: 272 of 292
- Download datasheet (5Mb)
PIC24HJXXXGPX06/X08/X10
25.2
DS70175H-page 270
64-Lead Plastic Thin Quad Flatpack (PT) – 10x10x1 mm Body, 2.00 mm Footprint [TQFP]
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Chamfers at corners are optional; size may vary.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.25 mm per side.
4. Dimensioning and tolerancing per ASME Y14.5M.
Note:
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Package Details
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
e
b
c
Number of Leads
Lead Pitch
Overall Height
Molded Package Thickness
Standoff
Foot Length
Footprint
Foot Angle
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
β
N
1 2 3
D
D1
L
Dimension Limits
E1
NOTE 2
φ
Units
A2
A1
L1
E1
D1
N
A
E
D
e
L
φ
c
b
α
β
E
A1
A
0.95
0.05
0.45
0.09
0.17
MIN
11°
11°
0°
–
MILLIMETERS
12.00 BSC
12.00 BSC
10.00 BSC
10.00 BSC
0.50 BSC
1.00 REF
L1
NOM
1.00
0.60
0.22
3.5°
12°
12°
64
–
–
–
Microchip Technology Drawing C04-085B
© 2009 Microchip Technology Inc.
MAX
1.20
1.05
0.15
0.75
0.20
0.27
13°
13°
7°
α
A2
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