PIC18LF258-I/SP Microchip Technology, PIC18LF258-I/SP Datasheet - Page 5

IC MCU FLASH 16KX16 LV CAN 28DIP

PIC18LF258-I/SP

Manufacturer Part Number
PIC18LF258-I/SP
Description
IC MCU FLASH 16KX16 LV CAN 28DIP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18LF258-I/SP

Core Size
8-Bit
Program Memory Size
32KB (16K x 16)
Oscillator Type
External
Core Processor
PIC
Speed
40MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
22
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Data Converters
A/D 5x10b
Operating Temperature
-40°C ~ 85°C
Package / Case
28-DIP (0.300", 7.62mm)
Controller Family/series
PIC18
No. Of I/o's
22
Eeprom Memory Size
256Byte
Ram Memory Size
1536Byte
Cpu Speed
40MHz
No.
RoHS Compliant
Processor Series
PIC18LF
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1.5 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
22
Number Of Timers
4 bit
Operating Supply Voltage
2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
Through Hole
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, DM163011, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
5 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18LF258-I/SP
Manufacturer:
Microchip Technology
Quantity:
135
MSSP MODULE
REVISION HISTORY
Revision A Document (7/2002):
2
Original version (I
C Slave Issue)
Revision B Document (1/2003):
Clarification of original issue to include Restart
conditions. Addition of data sheet clarification 1 (SPI
Mode, CKE bit).
Revision C Document (3/2003):
Addition of data sheet clarification 2 (SPI Slave Mode,
operation).
Revision D Document (9/2004):
2
Updated list of affected devices for silicon issue 1 (I
C
– Slave Mode) and 2 (MSSP – SPI, Slave Mode),
2
removed silicon issue 3 (I
C – Slave Mode) and added
2
data sheet clarifications 3 and 4 (MSSP – I
C Mode).
Revision E Document (7/2006):
Removed silicon issue 2 (MSSP – SPI, Slave Mode).
© 2006 Microchip Technology Inc.
DS80131E-page 5

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