PIC24HJ256GP210-I/PT Microchip Technology, PIC24HJ256GP210-I/PT Datasheet - Page 17

• Manufacturer Part Number: PIC24HJ256GP210-I/PT
• Description: IC PIC MCU FLASH 128KX16 100TQFP
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ256GP210-I/PT

• Core Size: 16-Bit
• Program Memory Size: 256KB (85.5K x 24)
• Core Processor: PIC
• Speed: 40 MIPs
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 85
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 32x10b, 32x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-TFQFP
• Controller Family/series: PIC24
• No. Of I/o's: 85
• Ram Memory Size: 16KB
• Cpu Speed: 40MIPS
• No. Of Timers: 13
• No. Of Pwm Channels: 8
• Embedded Interface Type: I2C, SPI, UART
• Rohs Compliant: Yes
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: CAN, I2C, SPI, UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 85
• Number Of Timers: 13
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 32 Channel
• A/d Bit Size: 12 bit
• A/d Channels Available: 32
• Height: 1 mm
• Length: 12 mm
• Supply Voltage (max): 3.6 V
• Supply Voltage (min): 3 V
• Width: 12 mm
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: 876-1004 - PIC24 BREAKOUT BOARDAC164333 - MODULE SKT FOR PM3 100QFPDM300024 - KIT DEMO DSPICDEM 1.1MA240012 - MODULE PLUG-IN PIC24H 100QFPDV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

2.0
2.1
Getting started with the PIC24HJXXXGPX06/X08/X10
family of 16-bit Microcontrollers (MCUs) requires
attention to a minimal set of device pin connections
before proceeding with development. The following is a
list of pin names, which must always be connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
• V
© 2009 Microchip Technology Inc.
Note:
(see Section 2.2 “Decoupling Capacitors”)
is not used)
(see Section 2.2 “Decoupling Capacitors”)
(see Section 2.3 “Capacitor on Internal Voltage
Regulator (V
(see Section 2.4 “Master Clear (MCLR) Pin”)
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
source is used
(see Section 2.6 “External Oscillator Pins”)
reference for ADC module is implemented
Note:
REF
CAP
DD
+/V
/V
DD
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
MICROCONTROLLERS
Basic Connection Requirements
DDCORE
and V
REF
and AV
This data sheet summarizes the features
of
family of devices. It is not intended to be a
comprehensive
complement the information in this data
sheet, refer to the “PIC24H Family
Reference Manual”, which is available
from
(www.microchip.com).
The AV
connected independent of the ADC
voltage reference source.
- pins used when external voltage
CAP
SS
the
SS
pins
/V
DD
DDCORE
pins (regardless if ADC module
the
PIC24HJXXXGPX06/X08/X10
and AV
reference
)”)
Microchip
SS
pins must be
source.
PIC24HJXXXGPX06/X08/X10
website
To
2.2
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
• Placement on the printed circuit board: The
• Handling high frequency noise: If the board is
• Maximizing performance: On the board layout
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the device. If space is constricted, the
capacitor can be placed on another layer on the
PCB using a via; however, ensure that the trace
length from the pin to the capacitor is within
one-quarter inch (6 mm) in length.
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the device pins. This ensures that the
decoupling capacitors are first in the power chain.
Equally important is to keep the trace length
between the capacitor and the power pins to a
minimum thereby reducing PCB track inductance.
SS
is required.
Decoupling Capacitors
DD
, V
DS70175H-page 15
SS
, AV
DD
and