DSPIC30F6012A-20E/PT Microchip Technology, DSPIC30F6012A-20E/PT Datasheet - Page 227

• Manufacturer Part Number: DSPIC30F6012A-20E/PT
• Description: IC DSPIC MCU/DSP 144K 64TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F6012A-20E/PT

• Program Memory Type: FLASH
• Program Memory Size: 144KB (48K x 24)
• Package / Case: 64-TFQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 20 MIPS
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 52
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC30F
• Core: dsPIC
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 52
• Data Ram Size: 8 KB
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011
• Minimum Operating Temperature: - 40 C
• Package: 64TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 20 MHz
• Operating Supply Voltage: 3.3|5 V
• Interface Type: CAN/I2C/SPI/UART
• On-chip Adc: 16-chx12-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC30F008 - MODULE SKT FOR DSPIC30F 64TQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

APPENDIX C:
The
dsPIC30F601x devices. The “A” version of the silicon is
identical in nearly all aspects compared to the
dsPID30F601x
dsPIC30F601x Silicon Errata documents posted on the
Microchip web to see what is fixed in the “A” version of
the silicon. This appendix describes the differences
between the dsPIC30F6011, 6012, 6013 and 6014 and
the dsPIC30F6011A, 6012A, 6013A and 6014A
devices, respectively.
C.1
The Programming Clock (PGC) and Data (PGD) pins
for the dsPIC30F6011A and dsPIC30F6012A devices
have been moved relative to the dsPIC30F6011 and
dsPIC30F6012 devices, respectively. The PGC/EMUC
function is now provided on the AN6/OCFA/RB6 pin
and the PGD/EMUD function is now provided on the
AN7/RB7
dsPIC30F6012A devices. Programming of these two
devices must use the new PGC/EMUC and PGD/
EMUD pins.
The PGC/EMUC and PGD/EMUD pins on the
dsPIC30F6013A and dsPIC30F6014A devices have
not been changed relative to the dsPIC30F6013 and
dsPIC30F6014 devices, respectively.
C.2
For the most part, dsPIC30F code developed with the
MPLAB C30 C Compiler and MPLAB ASM30 Assem-
bler is directly portable between the dsPIC30F601x
and dsPIC30F601xA devices. However, in some cases
small changes may be required depending on which
features have been enhanced. To migrate source code
to the “A” version of the devices, perform these two
steps:
1.
2.
Other changes are called out in this section. Read the
latest dsPIC30F601xA Silicon Errata documents
posted on the Microchip web site.
© 2006 Microchip Technology Inc.
Include the appropriate dsPIC30F601xA device
header (.h), linker (.gld) and include (.inc)
files in the source code files.
Remove any workarounds implemented in
source code or MPLAB C30 Compiler com-
mand-line options for errata described in the
“dsPIC30F6011/6012/6013/6014 Rev. B2
Silicon Errata” (DS80198B) document.
dsPIC30F601xA
PGC and PGD Programming Pins
Code Compatibility
pin
devices.
for
MIGRATION FROM
dsPIC30F601x TO
dsPIC30F601xA
DEVICES
dsPIC30F6011A/6012A/6013A/6014A
the
devices
Review
dsPIC30F6011A
supercede
the
latest
and
Preliminary
the
C.3
Several oscillator modes have been added to the
dsPIC30F601xA devices:
• FRC with x4, x8 and x16 PLL mode
• HS/2 with x4, x8 and x16 PLL mode
• HS/3 with x4, x8 and x16 PLL mode
The
Section 20.0 “System Integration”.
In support of the FRC, the OSCTUN Special Function
Register (SFR) has been added. This register includes
four FRC tuning bits (TUN<4:1>). This is a new feature
and hence there are no code or operational compatibil-
ity issues to address.
Another important change deals with the OSCCON
SFR. Bits have been added to both the COSC and
NOSC functional definitions. Use the “A” device header
(.h), linker (.gld) and include (.inc) files to achieve
code portability with the OSCCON SFR.
C.4
In support of the new Oscillator modes, the FOSC Con-
figuration
dsPIC30F6011A/6012A/6013A/6014A device header
and include files provide the updated bit field definitions
and macros for the device Configuration Registers.
Please refer to these new macros when embedding
specific device configuration information in the C and
Assembly source files.
C.5
The dsPIC30F6011A/6012A/6013A/6014A devices are
rated at 30MIPs @ 4.5-5.5 V
3.0-3.6 V
Even though compatible devices are tested to the
same electrical specifications, the device characteris-
tics may have changed due to normal process varia-
tions. These differences should not affect the systems
that were designed well within the device specifica-
tions. For systems that operate close to or outside the
specification limits, manufacturing differences may
cause the device to behave differently.
Note:
new
Oscillator Operation
Device Configuration Registers
Electrical Characteristics
DC
Oscillator operation should be verified to
ensure that it starts and performs as
expected. You may need to adjust the load
capacitor and/or the Oscillator mode to
achieve the proper values.
Register
for the Industrial Temperature range.
oscillator
has
modes
DC
been
and 20 MIPs @
are
DS70143C-page 225
modified.
presented
The
in