DSPIC33FJ256GP710-I/PT Microchip Technology, DSPIC33FJ256GP710-I/PT Datasheet - Page 23
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DSPIC33FJ256GP710-I/PT
Manufacturer Part Number
DSPIC33FJ256GP710-I/PT
Description
IC DSPIC MCU/DSP 256K 100TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 33Fr
Datasheets
1.DSPIC33FJ12GP201-ISO.pdf
(90 pages)
2.DSPIC33FJ64GP206-IPT.pdf
(322 pages)
3.DSPIC33FJ64GP206-IPT.pdf
(28 pages)
4.DSPIC33FJ128MC506-IPT.pdf
(24 pages)
Specifications of DSPIC33FJ256GP710-I/PT
Program Memory Type
FLASH
Program Memory Size
256KB (256K x 8)
Package / Case
100-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
40 MIPs
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Number Of I /o
85
Ram Size
30K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 32x10b/12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC33F
Core
dsPIC
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
85
Data Ram Size
30 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DM240002, DM330011, DM300019, DV164033, MA330011, MA330012, DM300024
Minimum Operating Temperature
- 40 C
Package
100TQFP
Device Core
dsPIC
Family Name
dSPIC33
Maximum Speed
40 MHz
Operating Supply Voltage
3.3 V
Interface Type
CAN/I2C/SPI/UART
On-chip Adc
64-chx10-bit|64-chx12-bit
Number Of Timers
9
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
876-1001 - DSPIC33 BREAKOUT BOARDAC164333 - MODULE SKT FOR PM3 100QFPDM300024 - KIT DEMO DSPICDEM 1.1DV164033 - KIT START EXPLORER 16 MPLAB ICD2MA330012 - MODULE DSPIC33 100P TO 84QFPMA330011 - MODULE DSPIC33 100P TO 100QFPDM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DSPIC33FJ256GP710-I/PT
Manufacturer:
MICROCHIP
Quantity:
12 000
Company:
Part Number:
DSPIC33FJ256GP710-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
Part Number:
DSPIC33FJ256GP710-I/PT
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
58. Module: UART
59. Module: I/O
60. Module: SPI
© 2010 Microchip Technology Inc.
The UART module will not generate consecutive
break characters. Trying to perform a back-to-back
Break character transmission will cause the UART
module to transmit the dummy character used to
generate the first Break character instead of
transmitting the second Break character. Break
characters are generated correctly if they are
followed by non-Break character transmission.
Work around
None.
Affected Silicon Revisions
While the device is being programmed via the
PGECx/PGEDx pin pair, the device pin with SDO1
functionality may start toggling.
Work around
None.
Affected Silicon Revisions
Regardless of the Slave setting for the Frame
delay bit (FRMDLY = 0 or FRMDLY = 1), the Slave
always acts as if the sync pulse precedes the first
SPI data bit (FRMDLY = 0). The SPI will not
function as described if Slave FRMDLY = 1.
Work around
None.
Affected Silicon Revisions
A2
A2
A2
X
X
X
A3
A3
A3
X
X
X
A4
A4
A4
X
X
X
61. Module: ADC
If the ADC module is in an enabled state when the
device enters Sleep mode as a result of executing
a PWRSAV #0 instruction, the device power-down
current (I
in the device data sheet. This may happen even if
the ADC module is disabled by clearing the ADON
bit prior to entering Sleep mode.
Work around
In order to remain within the I
listed in the device data sheet, the user software
must completely disable the ADC module by
setting the ADC Module Disable bit in the
corresponding Peripheral Module Disable register
(PMDx), prior to executing a PWRSAV
instruction.
Affected Silicon Revisions
A2
X
A3
X
PD
) may exceed the specifications listed
A4
X
DS80446D-page 23
PD
specifications
#0