PIC17C752-33I/PT Microchip Technology, PIC17C752-33I/PT Datasheet - Page 284
![IC MCU OTP 8KX16 A/D PWM 64TQFP](/photos/6/81/68123/c04-066_pf_sml.jpg)
PIC17C752-33I/PT
Manufacturer Part Number
PIC17C752-33I/PT
Description
IC MCU OTP 8KX16 A/D PWM 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 17Cr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC17C752-16L.pdf
(304 pages)
3.PIC17C752-16L.pdf
(4 pages)
4.PIC17C752-16L.pdf
(6 pages)
Specifications of PIC17C752-33I/PT
Core Processor
PIC
Core Size
8-Bit
Speed
33MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
50
Program Memory Size
16KB (8K x 16)
Program Memory Type
OTP
Ram Size
454 x 8
Voltage - Supply (vcc/vdd)
4.5 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TFQFP
Processor Series
PIC17C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
678 B
Interface Type
I2C, MSSP, RS- 232, SCI, SPI, USART
Maximum Clock Frequency
33 MHz
Number Of Programmable I/os
50
Number Of Timers
8
Operating Supply Voltage
3 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ICE2000, DM173001
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC17C752-33I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC16F616T-ISL PDF datasheet
- PIC17C752-16L PDF datasheet #2
- PIC17C752-16L PDF datasheet #3
- PIC17C752-16L PDF datasheet #4
- Current page: 284 of 304
- Download datasheet (6Mb)
PIC17C7XX
68-Lead Plastic Leaded Chip Carrier (L) – Square (PLCC)
DS30289B-page 284
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MO-047
Drawing No. C04-049
Number of Pins
Pitch
Pins per Side
Overall Height
Molded Package Thickness
Standoff §
Side 1 Chamfer Height
Corner Chamfer 1
Corner Chamfer (others)
Overall Width
Overall Length
Molded Package Width
Molded Package Length
Footprint Width
Footprint Length
Lead Thickness
Upper Lead Width
Lower Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
c
CH2 x 45
#leads=n1
n
E2
Dimension Limits
E1
E
1
2
CH1 x 45
Units
CH1
CH2
A2
A3
D1
D2
A1
E1
E2
B1
n1
A
n
E
D
c
B
p
D1
MIN
D
A2
.165
.145
.020
.024
.040
.000
.985
.985
.950
.950
.890
.890
.008
.026
.013
0
0
32
INCHES*
NOM
A
.050
.173
.153
.028
.029
.045
.005
.990
.990
.954
.954
.920
.920
.011
.029
.020
68
17
5
5
A3
MAX
.180
.160
.035
.034
.050
.010
.995
.995
.958
.958
.930
.930
.013
.032
.021
10
10
B1
B
MIN
25.02
25.02
24.13
24.13
22.61
22.61
4.19
3.68
1.02
0.00
0.20
0.66
0.33
0.51
0.61
D2
0
0
MILLIMETERS
p
NOM
2000 Microchip Technology Inc.
25.15
25.15
24.23
24.23
23.37
23.37
4.39
1.27
3.87
0.71
0.74
1.14
0.13
0.27
0.74
0.51
68
17
5
5
A1
MAX
25.27
25.27
24.33
24.33
23.62
23.62
4.57
4.06
0.89
0.86
1.27
0.25
0.33
0.81
0.53
10
10
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