PIC18C858-E/PT Microchip Technology, PIC18C858-E/PT Datasheet - Page 5
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PIC18C858-E/PT
Manufacturer Part Number
PIC18C858-E/PT
Description
IC MCU OTP 16KX16 CAN 80TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Cr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16C770-ISO.pdf
(8 pages)
3.PIC18C658-IPT.pdf
(366 pages)
4.PIC18C658-IPT.pdf
(16 pages)
5.PIC18C658-IPT.pdf
(16 pages)
6.PIC18C658-IPT.pdf
(16 pages)
Specifications of PIC18C858-E/PT
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, LVD, POR, PWM, WDT
Number Of I /o
68
Program Memory Size
32KB (16K x 16)
Program Memory Type
OTP
Ram Size
1.5K x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
80-TFQFP
Processor Series
PIC18C
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1536 B
Interface Type
3-Wire, I2C, SPI, USART, CAN
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
68
Number Of Timers
4 bit
Operating Supply Voltage
2.5 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
ICE2000, DM163007, DV164136
Minimum Operating Temperature
- 40 C
On-chip Adc
6
Data Rom Size
4 KB
Height
1 mm
Length
12 mm
Supply Voltage (max)
5.5 V
Supply Voltage (min)
4.2 V
Width
12 mm
For Use With
XLT80PT3 - SOCKET TRAN ICE 80MQFP/TQFPAC164320 - MODULE SKT MPLAB PM3 80TQFPAC174011 - MODULE SKT PROMATEII 80TQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Other names
PIC18C858E/PT
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC18C858-E/PT
Manufacturer:
MICROCHIP
Quantity:
12 000
Company:
Part Number:
PIC18C858-E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
MSSP MODULE
REVISION HISTORY
Revision A Document (7/2002):
2
Original version (I
C Slave Issue)
Revision B Document (1/2003):
Clarification of original issue to include Restart
conditions. Addition of data sheet clarification 1 (SPI
Mode, CKE bit).
Revision C Document (3/2003):
Addition of data sheet clarification 2 (SPI Slave Mode,
operation).
Revision D Document (9/2004):
2
Updated list of affected devices for silicon issue 1 (I
C
– Slave Mode) and 2 (MSSP – SPI, Slave Mode),
2
removed silicon issue 3 (I
C – Slave Mode) and added
2
data sheet clarifications 3 and 4 (MSSP – I
C Mode).
Revision E Document (7/2006):
Removed silicon issue 2 (MSSP – SPI, Slave Mode).
© 2006 Microchip Technology Inc.
DS80131E-page 5