STM8S903F3P6 STMicroelectronics, STM8S903F3P6 Datasheet - Page 5

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STM8S903F3P6

Manufacturer Part Number
STM8S903F3P6
Description
MCU 8BIT 8KB FLASH 20TSSOP
Manufacturer
STMicroelectronics
Series
STM8Sr
Datasheet

Specifications of STM8S903F3P6

Core Processor
STM8
Core Size
8-Bit
Speed
16MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
14
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Eeprom Size
640 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
2.95 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-TSSOP
Processor Series
STM8S90x
Core
STM8
3rd Party Development Tools
EWSTM8
Development Tools By Supplier
STICE-SYS001
Featured Product
STM32 Cortex-M3 Companion Products
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STM8S903F3P6
Manufacturer:
STM
Quantity:
3 621
Part Number:
STM8S903F3P6
Manufacturer:
ST
0
STM8S903K3 STM8S903F3
List of tables
Table 48. ADC accuracy with R
< 10 kΩ R
, V
= 3.3 V ..............................................................85
AIN
AIN
DD
Table 49. EMS data ................................................................................................................................87
Table 50. EMI data .................................................................................................................................88
Table 51. ESD absolute maximum ratings .............................................................................................89
Table 52. Electrical sensitivities .............................................................................................................89
Table 53. 32-pin low profile quad flat package mechanical data .........................................................100
Table 54. 32-lead, ultra thin, fine pitch quad flat no-lead package mechanical data .............................92
Table 55. 32-lead shrink plastic DIP (400 ml) package mechanical data ..............................................96
Table 56. 20-pin, 4.40 mm body, 0.65 mm pitch mechanical data .........................................................98
Table 57. 20-lead, plastic small outline (300 mils) mechanical data ......................................................98
Table 58. Thermal characteristics ........................................................................................................100
Table 59. Document revision history ....................................................................................................110
DocID15590 Rev 5
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