ST7FLIT10BF1M6 STMicroelectronics, ST7FLIT10BF1M6 Datasheet - Page 147
ST7FLIT10BF1M6
Manufacturer Part Number
ST7FLIT10BF1M6
Description
IC MCU 8BIT 4K FLASH 20-SOIC
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet
1.ST7FLIT15BY1M6.pdf
(159 pages)
Specifications of ST7FLIT10BF1M6
Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
17
Program Memory Size
4KB (4K x 8)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 7x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-SOIC (7.5mm Width)
Processor Series
ST7FLIT1x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
17
Number Of Timers
4
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7FLITE-SK/RAIS, ST7MDT10-DVP3, ST7MDT10-EMU3, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 7 Channel
For Use With
497-5049 - KIT STARTER RAISONANCE ST7FLITE
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
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Table 24. THERMAL CHARACTERISTICS
Notes:
1. The maximum chip-junction temperature is based on technology characteristics.
2. The maximum power dissipation is obtained from the formula P
The power dissipation of an application can be defined by the user with the formula: P
chip internal power (I
Symbol
P
T
R
Dmax
Jmax
thJA
Package thermal resistance
(junction to ambient)
Maximum junction temperature
Power dissipation
DD
xV
DD
) and P
Ratings
2)
PORT
is the port power dissipation depending on the ports used in the application.
1)
DIP16/SO16
DIP20/SO20
QFN20 (on 4-layer PCB)
QFN20 (on 2-layer PCB)
DIP16/SO16
DIP20/SO20
D
= (T
J
-T
A
) / R
thJA
.
D
=P
INT
+P
Value
150
300
300
85
85
43
95
PORT
where P
ST7LITE1xB
INT
147/159
°C/W
Unit
mW
°C
is the
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