ST7FLITE29F2M6TR STMicroelectronics, ST7FLITE29F2M6TR Datasheet - Page 120

• Manufacturer Part Number: ST7FLITE29F2M6TR
• Description: IC MCU 8BIT 8K FLASH 20-SOIC
• Manufacturer: STMicroelectronics
• Series: ST7r

Specifications of ST7FLITE29F2M6TR

• Core Processor: ST7
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 15
• Program Memory Size: 8KB (8K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 256 x 8
• Ram Size: 384 x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 5.5 V
• Data Converters: A/D 7x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 20-SOIC (7.5mm Width)
• Processor Series: ST7FLITE2x
• Core: ST7
• Data Bus Width: 8 bit
• Data Ram Size: 384 B
• Interface Type: SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 15
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: ST7FLIT2-COS/COM, ST7FLITE-SK/RAIS, ST7MDT10-DVP3, ST7MDT10-EMU3, STX-RLINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 7 Channel / 13 bit, 7 Channel
• For Use With: 497-5858 - EVAL BOARD PLAYBACK ST7FLITE497-5049 - KIT STARTER RAISONANCE ST7FLITE
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

ST7LITE2
PACKAGE CHARACTERISTICS (Cont’d)
Table 21. THERMAL CHARACTERISTICS
Notes:
1. The maximum chip-junction temperature is based on technology characteristics.
2. The maximum power dissipation is obtained from the formula P
The power dissipation of an application can be defined by the user with the formula: P
chip internal power (I
120/133
Symbol
P
T
R
Dmax
Jmax
thJA
DD
xV
DD
Package thermal resistance
(junction to ambient)
Maximum junction temperature
Power dissipation
) and P
PORT
is the port power dissipation depending on the ports used in the application.
2)
Ratings
1)
D
= (T
J
-T
DIP20
A
SO20
) / R
thJA
.
D
=P
INT
Value
125
150
500
63
+P
PORT
where P
INT
°C/W
Unit
mW
°C
is the