STM8L151K6T6 STMicroelectronics, STM8L151K6T6 Datasheet - Page 114
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STM8L151K6T6
Manufacturer Part Number
STM8L151K6T6
Description
IC MCU 8BIT 32KB FLASH 32LQFP
Manufacturer
STMicroelectronics
Series
STM8L EnergyLiter
Specifications of STM8L151K6T6
Core Processor
STM8
Core Size
8-Bit
Speed
16MHz
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, DMA, IR, POR, PWM, WDT
Number Of I /o
30
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Eeprom Size
1K x 8
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 22x12b, D/A 1x12
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
32-LQFP
Processor Series
STM8L15x
Core
STM8
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
16 MHz
Number Of Programmable I/os
30
Number Of Timers
5
Operating Supply Voltage
1.8 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWSTM8
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 22 Channel
On-chip Dac
12 bit, 1 Channel
For Use With
497-10594 - DEM FOR STM8L15X LOW PWR MODES
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-10514
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM8L151K6T6
Manufacturer:
MOT
Quantity:
45
Company:
Part Number:
STM8L151K6T6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM8L151K6T6
Manufacturer:
ST
Quantity:
20 000
1. Drawing is not to scale.
2. All leads/pads should also be soldered to the PCB to improve the lead/pad solder joint life.
3. There is an exposed die pad on the underside of the UFQFPN package. It is recommended to connect and solder this back-
4. Dimensions are in millimeters.
Package characteristics
Table 64.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
114/122
Figure 45. UFQFPN32 - 32-lead ultra thin fine pitch
side pad to PCB ground.
Dim.
ddd
D2
A1
A3
E2
A
D
E
N
b
e
L
Seating plane
Pin # 1 ID
R = 0.30
C
E2
A3
UFQFPN32 - 32-lead ultra thin fine pitch quad flat no-lead package (5 x 5),
quad flat no-lead package outline
(5 x 5)
package mechanical data
b
8
1
32
9
0.00
0.18
4.90
4.90
3.40
0.30
Min
0.5
(1)(2)(3)
e
Bottom view
D2
D
16
0.152
0.500
L
0.55
0.02
0.23
5.00
3.50
5.00
3.50
0.40
0.08
mm
Typ
17
24
L
A1
E
A
Doc ID 15962 Rev 6
ddd C
A0B8_ME
Max
0.05
0.28
5.10
5.10
3.60
0.50
0.6
Number of pins
32
Figure 46. UFQFPN32 recommended
0.0197
0.0071
0.1929
0.1929
0.1339
0.0118
Min
0
footprint
STM8L151xx, STM8L152xx
inches
0.0217
0.0008
0.0091
0.1969
0.1378
0.1969
0.1378
0.0197
0.0157
0.0031
0.006
Typ
(1)(4)
(1)
0.0110
0.0236
0.0020
0.2008
0.2008
0.1417
0.0197
Max