STM32F103R6H6A STMicroelectronics, STM32F103R6H6A Datasheet - Page 72

• Manufacturer Part Number: STM32F103R6H6A
• Description: MCU ARM 32BIT 32KB FLASH 64BGA
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103R6H6A

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 51
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 10K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-BGA
• Processor Series: STM32F103x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 10 KB
• Interface Type: CAN, I2C, SPI, USART
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 51
• Number Of Timers: 6
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: ST-LINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• Featured Product: STM32 Cortex-M3 Companion Products
• Eeprom Size: -
• For Use With: 497-10048 - BOARD EVAL ACCELEROMETER497-10030 - STARTER KIT FOR STM32KSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8511 - KIT STARTER FOR STM32 512K FLASH497-8505 - KIT STARTER FOR STM32F10XE MCU497-6438 - BOARD EVALUTION FOR STM32 512K497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2MCBSTM32 - BOARD EVAL FOR STM STM32X SER497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Electrical characteristics
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Figure 35. Typical connection diagram using the ADC
1. Refer to
2. C
General PCB design guidelines
Power supply decoupling should be performed as shown
depending on whether V
ceramic (good quality). They should be placed them as close as possible to the chip.
Figure 36. Power supply and reference decoupling (V
1. The V
pad capacitance (roughly 7 pF). A high C
this, f
parasitic
ADC
V AIN
REF+
Table 46
represents the capacitance of the PCB (dependent on soldering and PCB layout quality) plus the
should be reduced.
R AIN (1)
input is available only on the TFBGA64 package.
for the values of R
C parasitic
AINx
REF+
is connected to V
Doc ID 15060 Rev 5
AIN
V DD
, R
parasitic
ADC
0.6 V
0.6 V
V T
V T
and C
value will downgrade conversion accuracy. To remedy
ADC
I L ±1 µA
DDA
.
or not. The 10 nF capacitors should be
R ADC (1)
Sample and hold ADC
converter
inFigure 36
REF+
STM32F103x4, STM32F103x6
C ADC (1)
STM32F103xx
converter
not connected to
12-bit
or
Figure
37,
ai14150c
V
DDA
)