STM32F100R8T6B STMicroelectronics, STM32F100R8T6B Datasheet - Page 78

MCU 32BIT 64K FLASH 64LQFP

STM32F100R8T6B

Manufacturer Part Number
STM32F100R8T6B
Description
MCU 32BIT 64K FLASH 64LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F100R8T6B

Featured Product
STM32 Value Line
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
24MHz
Connectivity
I²C, IrDA, LIN, SPI, UART/USART
Peripherals
DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STM32F100x
Core
ARM Cortex M3
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Development Tools By Supplier
STM32100B-EVAL
For Use With
STM32100B-EVAL - EVAL BOARD FOR STM32F100VBT6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
497-10657
STM32F100R8T6B

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Package characteristics
78/87
Figure 41. TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package outline
1. Drawing is not to scale.
Table 50.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
A
A1
A2
A3
A4
b
D
D1
E
E1
e
F
ddd
eee
fff
Symbol
TFBGA64 - 8 x 8 active ball array, 5 x 5 mm, 0.5 mm pitch, package
mechanical data
Seating
plane
0.150
0.250
4.850
4.850
Min
C
millimeters
STM32F100x4, STM32F100x6, STM32F100x8, STM32F100xB
A4
A1
A3
A2
A
0.785
0.200
0.300
5.000
3.500
5.000
3.500
0.500
0.750
0.080
0.150
0.050
Doc ID 16455 Rev 6
Typ
B
H
G
F
E
D
C
B
A
A1 ball pad corner
e
1.200
0.600
0.350
5.150
5.150
Max
1
2
3
4
Bottom view
D
D1
5
0.0059
0.0098
0.1909
0.1909
Øb (64 balls)
6
Min
7
F
8
inches
F
e
0.0309
0.0079
0.0118
0.1969
0.1378
0.1969
0.1378
0.0197
0.0295
0.0031
0.0059
0.0020
Typ
E1
ME_R8
(1)
E
A
0.0472
0.0236
0.0138
0.2028
0.2028
Max

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