STM32F101RCT6TR STMicroelectronics, STM32F101RCT6TR Datasheet - Page 14

• Manufacturer Part Number: STM32F101RCT6TR
• Description: MCU 32BIT ARM 64K FLASH 64-LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F101RCT6TR

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 36MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: DMA, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 51
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LQFP
• Processor Series: STM32F101x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 36 MHz
• Number Of Programmable I/os: 51
• Number Of Timers: 9
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: STM3210E-EVAL
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• For Use With: 497-10030 - STARTER KIT FOR STM32497-6438 - BOARD EVALUTION FOR STM32 512K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Description
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Full compatibility throughout the family
The STM32F101xx is a complete family whose members are fully pin-to-pin, software and
feature compatible. In the reference manual, the STM32F101x4 and STM32F101x6 are
identified as low-density devices, the STM32F101x8 and STM32F101xB are referred to as
medium-density devices, and the STM32F101xC, STM32F101xD and STM32F101xE are
referred to as high-density devices.
Low- and high-density devices are an extension of the STM32F101x8/B medium-density
devices, they are specified in the STM32F101x4/6 and STM32F101xC/D/E datasheets,
respectively.
Low-density devices feature lower Flash memory and RAM capacities, less timers and
peripherals. High-density devices have higher Flash memory and RAM densities, and
additional peripherals like FSMC and DACwhile remaining fully compatible with the other
members of the family.
The STM32F101x4, STM32F101x6, STM32F101xC, STM32F101xD and STM32F101xE
are a drop-in replacement for the STM32F101x8/B devices, allowing the user to try different
memory densities and providing a greater degree of freedom during the development cycle.
Moreover, the STM32F101xx access line family is fully compatible with all existing
STM32F103xx performance line and STM32F102xx USB access line devices.
Table 3.
1. For orderable part numbers that do not show the A internal code after the temperature range code (6), the
Overview
ARM
The ARM Cortex™-M3 processor is the latest generation of ARM processors for embedded
systems. It has been developed to provide a low-cost platform that meets the needs of MCU
implementation, with a reduced pin count and low-power consumption, while delivering
outstanding computational performance and an advanced system response to interrupts.
Pinout
144
100
64
48
36
reference datasheet for electrical characteristics is that of the STM32F101x8/B medium-density devices.
®
Cortex™-M3 core with embedded Flash and SRAM
4 KB RAM 6 KB RAM 10 KB RAM 16 KB RAM
2 × USARTs
2 × 16-bit timers
1 × SPI, 1 × I
1 × ADC
Low-density devices Medium-density devices
16 KB
Flash
STM32F101xx family
2
Flash
C
32 KB
(1)
Doc ID 14610 Rev 7
3 × USARTs
3 × 16-bit timers
2 × SPIs, 2 × I2Cs,
1 × ADC
64 KB
Flash
STM32F101xC, STM32F101xD, STM32F101xE
Memory size
128 KB
Flash
5 × USARTs
4 × 16-bit timers, 2 × basic timers
3 × SPIs, 2 × I
FSMC (100 and 144 pins)
256 KB
32 KB
Flash
RAM
High-density devices
2
384 KB
Cs, 1 × ADC, 2 × DACs
48 KB
Flash
RAM
512 KB
48 KB
Flash
RAM