STM32F103R6T6 STMicroelectronics, STM32F103R6T6 Datasheet - Page 33
![MCU ARM 32KB FLASH MEM 64-LQFP](/photos/12/15/121504/stmicroelectronics-64-lqfp_sml.jpg)
STM32F103R6T6
Manufacturer Part Number
STM32F103R6T6
Description
MCU ARM 32KB FLASH MEM 64-LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet
1.STM32F103C4T6A.pdf
(87 pages)
Specifications of STM32F103R6T6
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
51
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
10K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
For Use With
497-10048 - BOARD EVAL ACCELEROMETER497-8853 - BOARD DEMO STM32 UNIV USB-UUSCIKSDKSTM32-PL - KIT IAR KICKSTART STM32 CORTEXM3497-8512 - KIT STARTER FOR STM32F10XE MCU497-8505 - KIT STARTER FOR STM32F10XE MCU497-8304 - KIT STM32 MOTOR DRIVER BLDC497-6289 - KIT PERFORMANCE STICK FOR STM32MCBSTM32UME - BOARD EVAL MCBSTM32 + ULINK-MEMCBSTM32U - BOARD EVAL MCBSTM32 + ULINK2MCBSTM32 - BOARD EVAL FOR STM STM32X SER497-6053 - KIT STARTER FOR STM32497-6052 - KIT STARTER FOR STM32497-6050 - KIT STARTER FOR STM32497-6049 - KIT EVALUATION LOW COST STM32497-6048 - BOARD EVALUATION FOR STM32497-6047 - KIT DEVELOPMENT FOR STM32497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
497-6064
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F103R6T6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Company:
Part Number:
STM32F103R6T6A
Manufacturer:
ST
Quantity:
611
Company:
Part Number:
STM32F103R6T6A
Manufacturer:
STMicroelectronics
Quantity:
10 000
STM32F103x4, STM32F103x6
5.3.2
5.3.3
Table 9.
1. When the ADC is used, refer to
2. It is recommended to power V
3. If T
4. In low power dissipation state, T
Operating conditions at power-up / power-down
Subject to general operating conditions for T
Table 10.
Embedded reset and power control block characteristics
The parameters given in
temperature and V
Symbol
Symbol
between V
characteristics on page
Table 6.2: Thermal characteristics on page
t
VDD
P
T
T
A
A
D
J
is lower, higher P
V
V
DD
General operating conditions (continued)
Operating conditions at power-up / power-down
DD
DD
Power dissipation at T
for suffix 6 or T
suffix 7
Ambient temperature for 6
suffix version
Ambient temperature for 7
suffix version
Junction temperature range
and V
rise time rate
fall time rate
Parameter
DD
DDA
(3)
D
supply voltage conditions summarized in
Parameter
81).
can be tolerated during power-up and operation.
values are allowed as long as T
Table 11
A
DD
= 105 °C for
A
Table 46: ADC
and V
can be extended to this range as long as T
Doc ID 15060 Rev 5
A
= 85 °C
are derived from tests performed under ambient
DDA
81).
from the same source. A maximum difference of 300 mV
characteristics.
Conditions
TFBGA64
LQFP64
LQFP48
VFQFPN36
Maximum power dissipation
Low power dissipation
Maximum power dissipation
Low power dissipation
6 suffix version
7 suffix version
A
.
J
does not exceed T
Conditions
Min
(4)
(4)
20
Table
0
J
J
max (see
Electrical characteristics
does not exceed T
9.
Min
–40
–40
–40
–40
–40
–40
Table 6.2: Thermal
Max
∞
∞
1000
Max
308
444
363
105
105
125
105
125
85
J
max (see
µs/V
Unit
Unit
mW
°C
°C
°C
33/87