STM32F103VCT6TR STMicroelectronics, STM32F103VCT6TR Datasheet - Page 114

• Manufacturer Part Number: STM32F103VCT6TR
• Description: MCU 32BIT ARM 256K FLASH 100-LQF
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32F103VCT6TR

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 72MHz
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
• Number Of I /o: 80
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 48K x 8
• Voltage - Supply (vcc/vdd): 2 V ~ 3.6 V
• Data Converters: A/D 16x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Processor Series: STM32F103x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 48 KB
• Interface Type: CAN, I2C, SPI, USART
• Maximum Clock Frequency: 72 MHz
• Number Of Programmable I/os: 80
• Number Of Timers: 11
• Operating Supply Voltage: 2 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 12 bit, 16 Channel
• On-chip Dac: 12 bit, 2 Channel
• For Use With: 497-10030 - STARTER KIT FOR STM32497-8511 - KIT STARTER FOR STM32 512K FLASH497-6438 - BOARD EVALUTION FOR STM32 512K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Package characteristics
6.2
6.2.1
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Thermal characteristics
The maximum chip junction temperature (T
Table 10: General operating conditions on page
The maximum chip-junction temperature, T
using the following equation:
Where:
●
●
●
●
P
taking into account the actual V
application.
Table 70.
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org
Symbol
I/O

JA
max represents the maximum power dissipation on output pins where:
T

P
P
internal power.
P
A
D
INT
I/O
JA
max is the maximum ambient temperature in °C,
max is the sum of P
is the package junction-to-ambient thermal resistance, in C/W,
max = (V
Thermal resistance junction-ambient
LFBGA144 - 10 × 10 mm / 0.8 mm pitch
Thermal resistance junction-ambient
LQFP144 - 20 × 20 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LFBGA100 - 10 × 10 mm / 0.8 mm pitch
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
Thermal resistance junction-ambient
WLCSP64
max is the product of I
Package thermal characteristics
OL
× I
OL
INT
T
) + ((V
J
Doc ID 14611 Rev 7
max = T
OL
max and P
DD
Parameter
/ I
and V
DD
OL
– V
A
and V
max + (P
DD
OH
I/O
STM32F103xC, STM32F103xD, STM32F103xE
J
J
, expressed in Watts. This is the maximum chip
max) must never exceed the values given in
max, in degrees Celsius, may be calculated
OH
) × I
max (P
42.
/ I
OH
D
OH
),
max x 
D
of the I/Os at low and high level in the
max = P
JA
)
INT
max + P
Value
40
30
40
46
45
50
I/O
max),
°C/W
Unit