STM32F103ZCT6 STMicroelectronics, STM32F103ZCT6 Datasheet - Page 12
![MCU ARM 32BIT 256K FLASH 144LQFP](/photos/39/66/396605/4767776_sml.jpg)
STM32F103ZCT6
Manufacturer Part Number
STM32F103ZCT6
Description
MCU ARM 32BIT 256K FLASH 144LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Specifications of STM32F103ZCT6
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
112
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 21x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
144-LQFP
Controller Family/series
(ARM Cortex) STM32
No. Of I/o's
112
Ram Memory Size
32KB
Cpu Speed
72MHz
No. Of Timers
8
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
Cpu Family
STM32
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
72MHz
Interface Type
CAN/I2C/SPI/USART
Total Internal Ram Size
48KB
# I/os (max)
112
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
On-chip Adc
3(21-chx12-bit)
On-chip Dac
2(2-chx12-bit)
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
For Use With
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Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STM32F103ZCT6
Manufacturer:
STMicroelectronics
Quantity:
20 000
Company:
Part Number:
STM32F103ZCT6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
STM32F103ZCT6
Manufacturer:
ST
Quantity:
20 000
Description
Figure 1.
1. T
2. AF = alternate function on I/O port pin.
12/123
5 ADC3_INs on ADC3
8 ADC123_INs
common to the 3 ADCs
8 ADC12_INs common
to ADC1 & ADC2
105 °C or 125 °C, respectively.
4 channels
3 compl. channels
BKIN, ETR as AF
4 channels
3 compl. channels
BKIN, ETR as AF
MOSI, MISO,
SCK, NSS as AF
NL (or NADV)
A
JTCK/SWCLK
RX, TX, CTS,
RTS, CK as AF
JTMS/SWDIO
TRACECLK
TRACED[0:3]
as AS
= –40 °C to +85 °C (suffix 6, see
CK as AF
NBL[1:0]
NE[4:1]
NJTRST
A[25:0]
D[15:0]
NWAIT
D[7:0]
PG[15:0]
as AF
CMD
PB[15:0]
PC[15:0]
PD[15:0]
PE[15:0]
PF[15:0]
PA[15:0]
NWE
NOE
JTDO
as AF
CLK
V
V
JTDI
112AF
REF–
REF+
STM32F103xC, STM32F103xD and STM32F103xE performance line block diagram
SW/JTAG
TPIU
Cortex-M3 CPU
Temp. sensor
12-bit ADC1
12-bit ADC2
12-bit ADC3
F max : 48/72 MHz
GPIO port C
GPIO port D
GPIO port G
GPIO port A
GPIO port B
GPIO port E
@ V DDA
GPIO port F
USART1
EXT.IT
WKUP
TIM1
TIM8
SPI1
NVIC
7 channels
5 channels
GP DMA1
GP DMA2
Trace/trig
SDIO
FSMC
IF
IF
IF
System
Table
Dbus
Pbus
Ibus
71) or –40 °C to +105 °C (suffix 7, see
AHB2
APB2
Trace
controller
Doc ID 14611 Rev 7
AHB2
APB1
SRAM
64 KB
Flash 512 Kbytes
Reset &
Clock
control
SRAM 512 B
64 bit
WWDG
TIM6
TIM7
PCLK1
PCLK2
HCLK
FCLK
STM32F103xC, STM32F103xD, STM32F103xE
RC 40 kHz
RC 8 MHz
@V DDA
PLL
Reset
POR
Int
V DD
Table
2x(8x16b
2x(8x16b
Backup interface
bxCAN device
IF IF
IF
USB 2.0 FS
device
SPI2 / I2S2
AWU
@V DDA
SPI3 / I2S3
RTC
Supply
supervision
Standby
POR / PDR
interface
12bit DAC1
12bit DAC 2
Volt. reg.
3.3 V to 1.8 V
USART2
USART3
@V DDA
IWDG
XTAL 32kHz
UART4
UART5
it)
it)
TIM4
TIM5
TIM2
TIM3
I2C1
I2C2
@V DD
XTAL OSC
4-16 MHz
PVD
71), junction temperature up to
@ V BAT
Power
@V DD
Backup
reg
V BAT =1.8 V to 3.6 V
OSC32_IN
OSC32_OUT
OSC_IN
OSC_OUT
NRST
V DDA
V SSA
V SS
DAC_OUT1 as AF
DAC_OUT2 as AF
TAMPER-RTC/
ALARM/SECOND OUT
USBDP/CAN_TX
USBDM/CAN_RX
4 channels, ETR as AF
4 channels, ETR as AF
4 channels, ETR as AF
4 channels as AF
RX, TX , CTS, RTS,
CK as AF
RX, TX, CTS, RTS,
CK as AF
MOSI/SD, MISO
SCK/CK, MCK, NSS/WS as AF
RX,TX as AF
RX,TX as AF
MOSI/SD, MISO
SCK/CK, MCK, NSS/WS as AF
SCL, SDA, SMBA as AF
SCL, SDA, SMBA as AF
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