STM32F105VCT7 STMicroelectronics, STM32F105VCT7 Datasheet - Page 36

MCU 32BIT ARM 256K FLASH 100-LQF

STM32F105VCT7

Manufacturer Part Number
STM32F105VCT7
Description
MCU 32BIT ARM 256K FLASH 100-LQF
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F105VCT7

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, IrDA, LIN, SPI, UART/USART, USB OTG
Peripherals
DMA, POR, PWM, Voltage Detect, WDT
Number Of I /o
80
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 105°C
Package / Case
100-LQFP
Processor Series
STM32F105x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN, I2C, SPI, USART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
80
Number Of Timers
10
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 105 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
On-chip Dac
12 bit, 2 Channel
Featured Product
STM32 Cortex-M3 Companion Products
Eeprom Size
-
For Use With
497-10591 - DAUGHTER BOARD FOR STM32497-9040 - DEV KIT FOR STM32497-9041 - DEV KIT FOR STM32497-9042 - DEV KIT FOR STM32497-9043 - DEV KIT FOR STM32497-8924 - EVAL BOARD FOR STM32F107VCT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details

Available stocks

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Electrical characteristics
5.3.2
5.3.3
36/101
Operating conditions at power-up / power-down
Subject to general operating conditions for T
Table 10.
Embedded reset and power control block characteristics
The parameters given in
temperature and V
Table 11.
1. The product behavior is guaranteed by design down to the minimum V
2. Guaranteed by design, not tested in production.
T
Symbol
RSTTEMPO
V
V
V
Symbol
t
PVDhyst
PDRhyst
POR/PDR
VDD
V
PVD
(2)
(2)
(2)
V
V
Operating conditions at power-up / power-down
Embedded reset and power control block characteristics
DD
DD
Programmable voltage
detector level selection
PVD hysteresis
Power on/power down
reset threshold
PDR hysteresis
Reset temporization
rise time rate
fall time rate
Parameter
DD
Parameter
supply voltage conditions summarized in
Table 11
Doc ID 15274 Rev 5
are derived from tests performed under ambient
PLS[2:0]=000 (rising edge)
PLS[2:0]=000 (falling edge)
PLS[2:0]=001 (rising edge)
PLS[2:0]=001 (falling edge)
PLS[2:0]=010 (rising edge)
PLS[2:0]=010 (falling edge)
PLS[2:0]=011 (rising edge)
PLS[2:0]=011 (falling edge)
PLS[2:0]=100 (rising edge)
PLS[2:0]=100 (falling edge)
PLS[2:0]=101 (rising edge)
PLS[2:0]=101 (falling edge)
PLS[2:0]=110 (rising edge)
PLS[2:0]=110 (falling edge)
PLS[2:0]=111 (rising edge)
PLS[2:0]=111 (falling edge)
Falling edge
Rising edge
Conditions
A
.
Conditions
POR/PDR
STM32F105xx, STM32F107xx
Min
20
Table
0
1.8
2.19
2.09
2.28
2.18
2.38
2.28
2.47
2.37
2.57
2.47
2.66
2.76
1.84
2.56
2.66
Min
2.1
value.
2
1
(1)
9.
2.18
2.08
2.18
2.28
2.38
2.48
2.58
1.88
2.28
2.38
2.48
2.58
2.68
2.78
2.68
2.88
2.78
1.92
Typ
Max
100
2.5
40
Max
2.26
2.16
2.37
2.27
2.48
2.38
2.58
2.48
2.69
2.59
2.79
2.69
1.96
2.9
2.8
2.9
2.0
4.5
3
µs/V
Unit
Unit
mV
mV
ms
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V

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