STM32F103ZET6TR STMicroelectronics, STM32F103ZET6TR Datasheet - Page 42
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STM32F103ZET6TR
Manufacturer Part Number
STM32F103ZET6TR
Description
MCU 32BIT ARM 512K FLASH 100-LQF
Manufacturer
STMicroelectronics
Series
STM32r
Specifications of STM32F103ZET6TR
Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
Peripherals
DMA, Motor Control PWM, PDR, POR, PVD, PWM, Temp Sensor, WDT
Number Of I /o
112
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 21x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
100-LQFP
Processor Series
STM32F103x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN, I2C, SPI, USART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
112
Number Of Timers
11
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, KSDK-STM32-PLUS, KSK-STM32F103ZE, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 21 Channel
On-chip Dac
12 bit, 2 Channel
Cpu Family
STM32
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
72MHz
Total Internal Ram Size
64KB
# I/os (max)
112
Number Of Timers - General Purpose
8
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
144
Package Type
LQFP
For Use With
497-10030 - STARTER KIT FOR STM32497-8511 - KIT STARTER FOR STM32 512K FLASH497-6438 - BOARD EVALUTION FOR STM32 512K
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Details
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Electrical characteristics
5.3
5.3.1
42/123
Table 9.
Operating conditions
General operating conditions
Table 10.
1. When the ADC is used, refer to
2. It is recommended to power V
3. If T
4. In low power dissipation state, T
Symbol
V
between V
characteristics on page
Table 6.2: Thermal characteristics on page
f
f
f
PCLK1
PCLK2
V
DDA
HCLK
V
P
T
T
BAT
DD
Symbol
A
A
D
J
T
is lower, higher P
(1)
STG
T
J
DD
Thermal characteristics
General operating conditions
Internal AHB clock frequency
Internal APB1 clock frequency
Internal APB2 clock frequency
Standard operating voltage
Analog operating voltage
(ADC not used)
Analog operating voltage
(ADC used)
Backup operating voltage
Power dissipation at T
85 °C for suffix 6 or T
105 °C for suffix 7
Ambient temperature for 6
suffix version
Ambient temperature for 7
suffix version
Junction temperature range
and V
DDA
Storage temperature range
Maximum junction temperature
D
Parameter
114).
can be tolerated during power-up and operation.
values are allowed as long as T
DD
A
Table 58: ADC
(3)
and V
can be extended to this range as long as T
Doc ID 14611 Rev 7
A
A
=
=
DDA
Ratings
114).
from the same source. A maximum difference of 300 mV
characteristics.
Must be the same potential
as V
LQFP144
LQFP100
LQFP64
LFBGA100
LFBGA144
Maximum power dissipation
Low power dissipation
Maximum power dissipation
Low power dissipation
6 suffix version
7 suffix version
STM32F103xC, STM32F103xD, STM32F103xE
DD
J
(2)
does not exceed T
Conditions
(4)
(4)
J
J
max (see
does not exceed T
–65 to +150
Min
–40
–40
–40
–40
–40
–40
2.4
1.8
Value
150
0
0
0
2
2
Table 6.2: Thermal
Max
666
434
444
500
500
105
105
125
105
125
3.6
3.6
3.6
3.6
72
36
72
85
J
max (see
Unit
MHz
Unit
mW
°C
°C
°C
°C
°C
V
V
V