STR750FV2T6 STMicroelectronics, STR750FV2T6 Datasheet - Page 51

• Manufacturer Part Number: STR750FV2T6
• Description: MCU 32BIT 256KB FLASH 100-LQFP
• Manufacturer: STMicroelectronics
• Series: STR7r

Specifications of STR750FV2T6

• Core Processor: ARM7
• Core Size: 32-Bit
• Speed: 60MHz
• Connectivity: CAN, I²C, SPI, SSI, SSP, UART/USART, USB
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 72
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 100-LQFP
• Cpu Family: STR7
• Device Core: ARM7TDMI-S
• Device Core Size: 32b
• Frequency (max): 60MHz
• Interface Type: CAN/I2C/SPI/SSI/SSP
• Total Internal Ram Size: 16KB
• # I/os (max): 72
• Number Of Timers - General Purpose: 6
• Operating Supply Voltage (typ): 3.3/5V
• Operating Supply Voltage (max): 5.5V
• Operating Supply Voltage (min): 2.97V
• On-chip Adc: 16-chx10-bit
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 100
• Package Type: LQFP
• Processor Series: STR750x
• Core: ARM7TDMI
• Data Bus Width: 32 bit
• Data Ram Size: 16 KB
• Maximum Clock Frequency: 60 MHz
• Number Of Programmable I/os: 72
• Number Of Timers: 6
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWARM, EWARM-BL, KSDK-STR750-PLUS, MCBSTR750, MCBSTR750U, MCBSTR750UME, MDK-ARM, RL-ARM, ULINK2
• Development Tools By Supplier: STR750-MCKIT, STR750-SK/HIT, STR750-SK/IAR, STR750-SK/KEIL, STR750-SK/RAIS, STR750-EVAL, STX-PRO/RAIS, STX-RLINK, STR79-RVDK/CPP, STR79-RVDK, STR79-RVDK/UPG
• Minimum Operating Temperature: - 40 C
• For Use With: MCBSTR750UME - BOARD EVAL MCBSTR750 + ULINK-MEMCBSTR750U - BOARD EVAL MCBSTR750 + ULINK2497-5988 - BOARD DEVELOPMENT LOVE STR750497-5754 - KIT STARTER IAR STR750497-5753 - KIT STARTER KEIL FOR STR7/STR9497-5752 - KIT STARTER IAR FOR STR7/STR9497-5751 - KIT STARTER HITEX FOR STR750497-5748 - BOARD EVALUATION FOR STR750XF497-5046 - KIT TOOL FOR ST7/UPSD/STR7 MCU
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Compliant
• Other names: 497-5650

STR750Fxx STR751Fxx STR752Fxx STR755Fxx
6.3.7
EMC characteristics
Susceptibility tests are performed on a sample basis during product characterization.
Functional EMS (electro magnetic susceptibility)
Based on a simple running application on the product (toggling 2 LEDs through I/O ports),
the product is stressed by two electro magnetic events until a failure occurs (indicated by the
LEDs).
●
●
A device reset allows normal operations to be resumed. The test results are given in the
table below based on the EMS levels and classes defined in application note AN1709.
Designing hardened software to avoid noise problems
EMC characterization and optimization are performed at component level with a typical
application environment and simplified MCU software. It should be noted that good EMC
performance is highly dependent on the user application and the software in particular.
Therefore it is recommended that the user applies EMC software optimization and
prequalification tests in relation with the EMC level requested for his application.
Software recommendations:
The software flowchart must include the management of runaway conditions such as:
●
●
●
Prequalification trials:
Most of the common failures (unexpected reset and program counter corruption) can be
reproduced by manually forcing a low state on the RESET pin or the Oscillator pins for 1
second.
To complete these trials, ESD stress can be applied directly on the device, over the range of
specification values. When unexpected behaviour is detected, the software can be
hardened to prevent unrecoverable errors occurring (see application note AN1015).
Table 28.
Symbol
V
V
FESD
EFTB
ESD: Electro-Static Discharge (positive and negative) is applied on all pins of the
device until a functional disturbance occurs. This test conforms with the IEC 1000-4-2
standard.
FTB: A Burst of Fast Transient voltage (positive and negative) is applied to V
V
conforms with the IEC 1000-4-4 standard.
Corrupted program counter
Unexpected reset
Critical Data corruption (control registers...)
SS
through a 100pF capacitor, until a functional disturbance occurs. This test
Voltage limits to be applied on any I/O pin to
induce a functional disturbance
Fast transient voltage burst limits to be applied
through 100pF on V
a functional disturbance
EMC characteristics
Parameter
DD
and V
SS
pins to induce
V
T
conforms to IEC 1000-4-2
V
T
conforms to IEC 1000-4-4
A
A
DD_IO
DD_IO
=+25° C, f
=+25° C, f
=3.3 V or 5 V,
=3.3 V or 5 V,
Conditions
CK_SYS
CK_SYS
Electrical parameters
=32 MHz
=32 MHz
DD
Class A
Class A
Level/
Class
and
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