STM32F107RCT6 STMicroelectronics, STM32F107RCT6 Datasheet - Page 77

MCU ARM 256KB FLASH MEM 64-LQFP

STM32F107RCT6

Manufacturer Part Number
STM32F107RCT6
Description
MCU ARM 256KB FLASH MEM 64-LQFP
Manufacturer
STMicroelectronics
Series
STM32r
Datasheet

Specifications of STM32F107RCT6

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
72MHz
Connectivity
CAN, Ethernet, I²C, IrDA, LIN, SPI, UART/USART, USB OTG
Peripherals
DMA, POR, PWM, Voltage Detect, WDT
Number Of I /o
51
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
64K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 3.6 V
Data Converters
A/D 16x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-LQFP
Processor Series
STM32F107x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
64 KB
Interface Type
CAN, I2C, SPI, USART
Maximum Clock Frequency
72 MHz
Number Of Programmable I/os
51
Number Of Timers
10
Operating Supply Voltage
2 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWARM, EWARM-BL, MDK-ARM, RL-ARM, ULINK2
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit x 2, 16 Channel
On-chip Dac
12 bit x 2, 2 Channel
Cpu Family
STM32
Device Core
ARM Cortex-M3
Device Core Size
32b
Frequency (max)
72MHz
Total Internal Ram Size
64KB
# I/os (max)
51
Number Of Timers - General Purpose
7
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
2V
Instruction Set Architecture
RISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Surface Mount
Pin Count
64
Package Type
LQFP
For Use With
497-10591 - DAUGHTER BOARD FOR STM32497-10064 - EVAL BOARD497-9040 - DEV KIT FOR STM32497-9041 - DEV KIT FOR STM32497-9042 - DEV KIT FOR STM32497-9043 - DEV KIT FOR STM32497-8924 - EVAL BOARD FOR STM32F107VCT497-8853 - BOARD DEMO STM32 UNIV USB-UUSCI
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-8914

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STM32F105xx, STM32F107xx
Table 55.
1. Guaranteed by design, not tested in production.
2. Guaranteed by characterization, not tested in production.
Figure 38. 12-bit buffered /non-buffered DAC
1. The DAC integrates an output buffer that can be used to reduce the output impedance and to drive external loads directly
Offset
Gain
error
t
Update
rate
t
PSRR+
SETTLING
WAKEUP
Symbol
without the use of an external operational amplifier. The buffer can be bypassed by configuring the BOFFx bit in the
DAC_CR register.
(2)
(2)
(2)
(1)
(2)
(2)
Offset error
(difference between
measured value at Code
(0x800) and the ideal value =
V
Gain error
Settling time (full scale: for a
10-bit input code transition
between the lowest and the
highest input codes when
DAC_OUT reaches final
value ±1LSB
Max frequency for a correct
DAC_OUT change when
small variation in the input
code (from code i to i+1LSB)
Wakeup time from off state
(Setting the ENx bit in the
DAC Control register)
Power supply rejection ratio
(to V
measurement
DAC characteristics (continued)
REF+
DDA
/2)
) (static DC
Parameter
Buffered/Non-buffered DAC
12-bit
digital to
analog
converter
Min
Doc ID 15274 Rev 5
Buffer(1)
–67
Typ
6.5
3
DACx_OUT
Max
±0.5
±10
±12
–40
±3
10
4
1
MS/s
Unit
LSB
LSB
mV
dB
µs
µs
%
C
R
LOAD
LOAD
Given for the DAC in 12-bit
configuration
Given for the DAC in 10-bit at
V
Given for the DAC in 12-bit at
V
Given for the DAC in 12bit
configuration
C
R
C
R
C
input code between lowest and
highest possible ones.
No R
REF+
REF+
LOAD
LOAD
LOAD
LOAD
LOAD
LOAD
Electrical characteristics
= 3.6 V
= 3.6 V
 50 pF,
 5 k
 50 pF,
 5 k
 50 pF, R
, C
ai17157
Comments
LOAD
LOAD
= 50 pF
 5 k
77/101

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