MAXQ610A-0000+ Maxim Integrated Products, MAXQ610A-0000+ Datasheet - Page 6

• Manufacturer Part Number: MAXQ610A-0000+
• Description: IC MCU 16BIT 64K IR MOD 32TQFN
• Manufacturer: Maxim Integrated Products
• Series: MAXQ™r

Specifications of MAXQ610A-0000+

• Core Processor: RISC
• Core Size: 16-Bit
• Speed: 12MHz
• Connectivity: SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Infrared, Power-Fail, POR, WDT
• Number Of I /o: 20
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 1.7 V ~ 3.6 V
• Oscillator Type: Internal
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 32-TQFN Exposed Pad
• Processor Series: MAXQ610
• Core: RISC
• Data Bus Width: 16 bit
• Data Ram Size: 2 KB
• Interface Type: SPI, USART
• Maximum Clock Frequency: 12 MHz
• Number Of Timers: 4
• Operating Supply Voltage: 1.7 V to 3.6 V
• Maximum Operating Temperature: + 70 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: 0 C
• Controller Family/series: MAXQ
• No. Of I/o's: 24
• Ram Memory Size: 2048Byte
• Cpu Speed: 12MHz
• No. Of Timers: 2
• Embedded Interface Type: JTAG, SPI, USART
• Rohs Compliant: Yes
• Number Of Programmable I/os: 32
• Development Tools By Supplier: MAXQ610-KIT
• Package: 32TQFN EP
• Family Name: MAXQ
• Maximum Speed: 12 MHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Data Converters: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 90-M6800+B01

16-Bit Microcontroller with Infrared Module
RECOMMENDED DC OPERATING CONDITIONS (continued)
(V
Note 1:
Note 2:
Note 3:
Note 4:
Note 5:
Note 6:
Note 7:
Note 8:
Note 9:
Note 10: The maximum total current, I
Note 11: Programming time does not include overhead associated with utility ROM interface.
6
WAKE-UP TIMER
Wake-Up Timer Interval
FLASH MEMORY
System Clock During Flash
Programming/Erase
Flash Erase Time
Flash Programming Time per
Word
Write/Erase Cycles
Data Retention
IR
Carrier Frequency
DD
_______________________________________________________________________________________
= V
RST
PARAMETER
Specifications to 0°C are guaranteed by design and are not production tested.
It is not recommended to write to flash memory when the supply voltage drops below the power-fail warning levels as
there is uncertainty in the duration of continuous power supply. The user application should check the status of the power-
fail warning flag before writing to flash to ensure complete write operations.
The power-fail warning monitor and the power-fail reset monitor track each other with a minimum delta between the two of
0.11V.
The power-fail reset and power-on-reset (POR) detectors operate in tandem to ensure that one or both signals are active
at all times when V
achieved.
Guaranteed by design and not production tested.
Measured on the V
any current. Part is executing code from flash memory.
The power-check interval (PCI) can be set to always on, 1024, 2048, or 4096 nanopower ring oscillator clock cycles.
Current consumption during POR when powering up while V
The minimum amount of time that V
the maximum specified voltage drop. This does not include the IRTX output.
to 3.6V, T
A
= 0°C to +70°C.) (Note 1)
DD
DD
< V
pin and the part not in reset. All inputs are connected to GND or V
RST
f
SYMBOL
FPSYSCLK
t
WAKEUP
t
t
OH
ERASE
. Doing so ensures the device maintains the reset state until the minimum operating voltage is
PROG
t
f
ME
IR
(max) and I
DD
must be below V
Mass erase
Page erase
(Note 11)
T
(Note 5)
A
= +25°C
OL
(max), for all listed outputs combined should not exceed 32mA to satisfy
CONDITIONS
PFW
before a power-fail event is detected.
DD
< V
POR
.
1/f
20,000
MIN
100
NANO
20
20
20
DD
5
. Outputs do not source/sink
TYP
65,535/
f
NANO
MAX
f
CK
100
40
40
/2
Cycles
UNITS
Years
MHz
ms
Hz
μs
s