PIC16C64-10/L Microchip Technology, PIC16C64-10/L Datasheet - Page 249
![MICRO CTRL 2K X 14 OTP 44 PLCC](/photos/6/63/66325/150-44-plcc_sml.jpg)
PIC16C64-10/L
Manufacturer Part Number
PIC16C64-10/L
Description
MICRO CTRL 2K X 14 OTP 44 PLCC
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Specifications of PIC16C64-10/L
Core Processor
PIC
Core Size
8-Bit
Speed
10MHz
Connectivity
I²C, SPI
Peripherals
POR, PWM, WDT
Number Of I /o
33
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
OTP
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Oscillator Type
External
Operating Temperature
0°C ~ 70°C
Package / Case
44-PLCC
Lead Free Status / RoHS Status
Request inventory verification / Request inventory verification
Eeprom Size
-
Data Converters
-
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22.2
DC CHARACTERISTICS
D001
D002*
D003
D004*
D005
D010
D010A
D015*
D020
D021
D021A
D023*
Note 1: This is the limit to which V
Param
1997 Microchip Technology Inc.
*
†
No.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin
3: The power-down current in SLEEP mode does not depend on the oscillator type. Power-down current is mea-
4: For RC osc configuration, current through Rext is not included. The current through the resistor can be esti-
5: Timer1 oscillator (when enabled) adds approximately 20 A to the specification. This value is from character-
6: The
These parameters are characterized but not tested.
Data in "Typ" column is at 5V, 25˚C unless otherwise stated. These parameters are for design guidance only
and are not tested.
DC Characteristics:
loading and switching rate, oscillator type, internal code execution pattern, and temperature also have an
impact on the current consumption.
The test conditions for all I
OSC1 = external square wave, from rail to rail; all I/O pins tristated, pulled to V
MCLR = V
sured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V
mated by the formula Ir = V
ization and is for design guidance only. This is not tested.
added to the base I
Supply Voltage
RAM Data Retention
Voltage (Note 1)
V
ensure internal Power-on
Reset signal
V
internal Power-on Reset
signal
Brown-out Reset Voltage
Supply Current (Note 2, 5)
Brown-out Reset Current
(Note 6)
Power-down Current
(Note 3, 5)
Brown-out Reset Current
(Note 6)
DD
DD
start voltage to
rise rate to ensure
current is the additional current consumed when this peripheral is enabled. This current should be
Characteristic
DD
; WDT enabled/disabled as specified.
DD
or I
Applicable Devices 61 62 62A R62 63 R63 64 64A R64 65 65A R65 66 67
PD
DD
DD
PIC16LCR63/R65-04 (Commercial, Industrial)
DD
Standard Operating Conditions (unless otherwise stated)
Operating temperature
V
V
V
S
B
I
I
measurement.
can be lowered without losing RAM data.
measurements in active operation mode are:
DD
PD
/2Rext (mA) with Rext in kOhm.
Sym
DD
DR
POR
VDD
VDD
I
I
BOR
BOR
0.05
Min
3.0
3.7
-
-
-
-
-
-
-
-
-
Preliminary
Typ† Max Units
22.5
V
350
350
1.5
4.0
2.0
7.5
0.9
0.9
SS
-
-
425
425
5.5
4.3
3.8
48
30
5
5
-
-40˚C
0˚C
-
-
V/ms See section on Power-on Reset for details
mA
V
V
V
V
A
A
A
A
A
A
T
T
LP, XT, RC osc configuration (DC - 4 MHz)
See section on Power-on Reset for details
BODEN configuration bit is enabled
XT, RC osc configuration
F
LP osc configuration
F
BOR enabled, V
V
V
V
BOR enabled, V
A
A
OSC
OSC
DD
DD
DD
+85˚C for industrial and
+70˚C for commercial
= 3.0V, WDT enabled, -40 C to +85 C
= 3.0V, WDT disabled, 0 C to +70 C
= 3.0V, WDT disabled, -40 C to +85 C
= 4 MHz, V
= 32 kHz, V
DD
,
DD
DD
Conditions
PIC16C6X
DD
DD
= 5.0V
= 5.0V
= 3.0V (Note 4)
= 3.0V, WDT disabled
DD
DS30234D-page 249
and V
SS
.
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