PIC16C72-10E/SP Microchip Technology, PIC16C72-10E/SP Datasheet - Page 251
![IC MCU OTP 2KX14 A/D PWM 28DIP](/photos/6/59/65908/150-28-dip_sml.jpg)
PIC16C72-10E/SP
Manufacturer Part Number
PIC16C72-10E/SP
Description
IC MCU OTP 2KX14 A/D PWM 28DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F818-ISO.pdf
(6 pages)
3.PIC16C72-04SO.pdf
(289 pages)
4.PIC16C72-04SO.pdf
(125 pages)
5.PIC16C72-04SO.pdf
(8 pages)
Specifications of PIC16C72-10E/SP
Core Processor
PIC
Core Size
8-Bit
Speed
10MHz
Connectivity
I²C, SPI
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
22
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
OTP
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Data Converters
A/D 5x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
28-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
- PIC16F616T-ISL PDF datasheet
- PIC16F818-ISO PDF datasheet #2
- PIC16C72-04SO PDF datasheet #3
- PIC16C72-04SO PDF datasheet #4
- PIC16C72-04SO PDF datasheet #5
- Current page: 251 of 289
- Download datasheet (3Mb)
22.0
22.1
Base
Plane
Seating
Plane
1997 Microchip Technology Inc.
Symbol
A1
A2
A3
B1
D1
E1
eA
eB
S1
Pin #1
Indicator Area
e1
B1
C
D
E
N
S
A
B
L
PACKAGING INFORMATION
28-Lead Ceramic Side Brazed Dual In-Line with Window (300 mil)(JW)
N
S
B
35.204
32.893
3.937
1.016
2.921
1.930
0.406
1.219
0.228
7.620
7.366
2.413
7.366
7.594
3.302
1.143
0.533
Min
28
0
Package Group: Ceramic Side Brazed Dual In-Line (CER)
Millimeters
35.916
33.147
5.030
1.524
3.506
2.388
0.508
1.321
0.305
8.128
7.620
2.667
7.874
8.179
4.064
1.397
0.737
Max
10
28
D
D1
Reference
Reference
Typical
Typical
Typical
Notes
0.155
0.040
0.115
0.076
0.016
0.048
0.009
1.386
1.295
0.300
0.290
0.095
0.290
0.299
0.130
0.045
0.021
Min
28
0
S1
e1
L
E1 E
A1
A3
Inches
0.198
0.060
0.138
0.094
0.020
0.052
0.012
1.305
0.320
0.300
0.105
0.310
0.322
0.160
0.055
0.029
1.414
Max
10
28
PIC16C7X
A
A2
DS30390E-page 251
eA
eB
Notes
C
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