PIC16C74A-10I/PT Microchip Technology, PIC16C74A-10I/PT Datasheet - Page 124
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PIC16C74A-10I/PT
Manufacturer Part Number
PIC16C74A-10I/PT
Description
IC MCU OTP 4KX14 A/D PWM 44TQFP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F818-ISO.pdf
(6 pages)
3.PIC16C72-04SO.pdf
(289 pages)
4.PIC16LC74A-04P.pdf
(8 pages)
Specifications of PIC16C74A-10I/PT
Core Processor
PIC
Core Size
8-Bit
Speed
10MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Program Memory Size
7KB (4K x 14)
Program Memory Type
OTP
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 6 V
Data Converters
A/D 8x8b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
44-TQFP, 44-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16C74A-10I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC16F616T-ISL PDF datasheet
- PIC16F818-ISO PDF datasheet #2
- PIC16C72-04SO PDF datasheet #3
- PIC16LC74A-04P PDF datasheet #4
- Current page: 124 of 289
- Download datasheet (3Mb)
PIC16C7X
13.5
The A/D module can operate during SLEEP mode. This
requires that the A/D clock source be set to RC
(ADCS1:ADCS0 = 11). When the RC clock source is
selected, the A/D module waits one instruction cycle
before starting the conversion. This allows the SLEEP
instruction to be executed, which eliminates all digital
switching noise from the conversion. When the conver-
sion is completed the GO/DONE bit will be cleared, and
the result loaded into the ADRES register. If the A/D
interrupt is enabled, the device will wake-up from
SLEEP. If the A/D interrupt is not enabled, the A/D mod-
ule will then be turned off, although the ADON bit will
remain set.
When the A/D clock source is another clock option (not
RC), a SLEEP instruction will cause the present conver-
sion to be aborted and the A/D module to be turned off,
though the ADON bit will remain set.
Turning off the A/D places the A/D module in its lowest
current consumption state.
13.6
The absolute accuracy specified for the A/D converter
includes the sum of all contributions for quantization
error, integral error, differential error, full scale error, off-
set error, and monotonicity. It is defined as the maxi-
mum deviation from an actual transition versus an ideal
transition for any code. The absolute error of the A/D
converter is specified at < 1 LSb for V
the device’s specified operating range). However, the
accuracy of the A/D converter will degrade as V
diverges from V
For a given range of analog inputs, the output digital
code will be the same. This is due to the quantization of
the analog input to a digital code. Quantization error is
typically
ital conversion process. The only way to reduce quan-
tization error is to increase the resolution of the A/D
converter.
Offset error measures the first actual transition of a
code versus the first ideal transition of a code. Offset
error shifts the entire transfer function. Offset error can
be calibrated out of a system or introduced into a sys-
tem through the interaction of the total leakage current
and source impedance at the analog input.
DS30390E-page 124
Note:
A/D Operation During Sleep
A/D Accuracy/Error
Applicable Devices
72 73 73A 74 74A 76 77
Applicable Devices
72 73 73A 74 74A 76 77
1/2 LSb and is inherent in the analog to dig-
For the A/D module to operate in SLEEP,
the A/D clock source must be set to RC
(ADCS1:ADCS0 = 11). To perform an A/D
conversion in SLEEP, ensure the SLEEP
instruction immediately follows the instruc-
tion that sets the GO/DONE bit.
REF
.
DD
= V
REF
(over
DD
Gain error measures the maximum deviation of the last
actual transition and the last ideal transition adjusted
for offset error. This error appears as a change in slope
of the transfer function. The difference in gain error to
full scale error is that full scale does not take offset error
into account. Gain error can be calibrated out in soft-
ware.
Linearity error refers to the uniformity of the code
changes. Linearity errors cannot be calibrated out of
the system. Integral non-linearity error measures the
actual code transition versus the ideal code transition
adjusted by the gain error for each code.
Differential non-linearity measures the maximum actual
code width versus the ideal code width. This measure
is unadjusted.
The maximum pin leakage current is
In systems where the device frequency is low, use of
the A/D RC clock is preferred. At moderate to high fre-
quencies, T
lator. T
when derived from T
phase clock transitions. This reduces, to a large extent,
the effects of digital switching noise. This is not possi-
ble with the RC derived clock. The loss of accuracy due
to digital switching noise can be significant if many I/O
pins are active.
In systems where the device will enter SLEEP mode
after the start of the A/D conversion, the RC clock
source selection is required. In this mode, the digital
noise from the modules in SLEEP are stopped. This
method gives high accuracy.
13.7
A device reset forces all registers to their reset state.
This forces the A/D module to be turned off, and any
conversion is aborted.
The value that is in the ADRES register is not modified
for a Power-on Reset. The ADRES register will contain
unknown data after a Power-on Reset.
8 s for preferred operation. This is because T
AD
Effects of a RESET
Applicable Devices
72 73 73A 74 74A 76 77
must not violate the minimum and should be
AD
should be derived from the device oscil-
OSC
, is kept away from on-chip
1997 Microchip Technology Inc.
1 A.
AD
,
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