PIC16F874-04E/P Microchip Technology, PIC16F874-04E/P Datasheet - Page 103
![IC MCU FLASH 4KX14 EE 40DIP](/photos/6/61/66192/150-40-dip_sml.jpg)
PIC16F874-04E/P
Manufacturer Part Number
PIC16F874-04E/P
Description
IC MCU FLASH 4KX14 EE 40DIP
Manufacturer
Microchip Technology
Series
PIC® 16Fr
Datasheets
1.PIC16F616T-ISL.pdf
(8 pages)
2.PIC16F688T-ISL.pdf
(688 pages)
3.PIC16F873-04SO.pdf
(218 pages)
4.PIC16F873-04SO.pdf
(5 pages)
5.PIC16F873-04SO.pdf
(5 pages)
Specifications of PIC16F874-04E/P
Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
33
Program Memory Size
7KB (4K x 14)
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
192 x 8
Voltage - Supply (vcc/vdd)
4 V ~ 5.5 V
Data Converters
A/D 8x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
40-DIP (0.600", 15.24mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
PIC16F87404E/P
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PIC16F874-04E/PQ
Manufacturer:
Microchip Technology
Quantity:
10 000
Company:
Part Number:
PIC16F874-04E/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
- PIC16F616T-ISL PDF datasheet
- PIC16F688T-ISL PDF datasheet #2
- PIC16F873-04SO PDF datasheet #3
- PIC16F873-04SO PDF datasheet #4
- PIC16F873-04SO PDF datasheet #5
- Current page: 103 of 688
- Download datasheet (3Mb)
6.3.3
1997 Microchip Technology Inc.
Banking
The data memory is partitioned into four banks. Each bank contains General Purpose Registers
and Special Function Registers. Switching between these banks requires the RP0 and RP1 bits
in the STATUS register to be configured for the desired bank when using direct addressing. The
IRP bit in the STATUS register is used for indirect addressing.
Table 6-1:
Each Bank extends up to 7Fh (128 bytes). The lower locations of each bank are reserved for the
Special Function Registers. Above the Special Function Registers are General Purpose Regis-
ters. All data memory is implemented as static RAM. All Banks may contain special function reg-
isters. Some “high use” special function registers from Bank0 are mirrored in the other banks for
code reduction and quicker access.
Through the evolution of the products, there are a few variations in the layout of the Data Memory.
The data memory organization that will be the standard for all new devices is shown in
Figure
reduce the software overhead for context switching. The registers in bold will be in every device.
The other registers are peripheral dependent. Not every peripheral’s registers are shown,
because some file addresses have a different registers from those shown. As with all the figures,
tables, and specifications presented in this reference guide, verify the details with the device spe-
cific data sheet.
Figure 6-4: Direct Addressing
Accessed
Bank
RP1 RP0
bank select
0
1
2
3
6-5. This Memory map has the last 16-bytes mapped across all memory banks. This is to
Section 6. Memory Organization
Direct and Indirect Addressing of Banks
(RP1:RP0)
Direct
location select
6
Direct Addressing
0 0
0 1
1 0
1 1
Data
Memory
from opcode
Indirect
(IRP)
7Fh
00h
0
1
Bank0
00
0
Bank1
01
Bank2
10
Bank3
11
DS31006A-page 6-9
7Fh
6
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