PIC16LCE625-04E/P Microchip Technology, PIC16LCE625-04E/P Datasheet - Page 98

IC MCU CMOS 2K OTP W/EEPRM 18DIP

PIC16LCE625-04E/P

Manufacturer Part Number
PIC16LCE625-04E/P
Description
IC MCU CMOS 2K OTP W/EEPRM 18DIP
Manufacturer
Microchip Technology
Series
PIC® 16Cr
Datasheet

Specifications of PIC16LCE625-04E/P

Core Processor
PIC
Core Size
8-Bit
Speed
4MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
13
Program Memory Size
3.5KB (2K x 14)
Program Memory Type
OTP
Eeprom Size
128 x 8
Ram Size
128 x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
18-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data Converters
-
Connectivity
-
PIC16CE62X
18-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
DS40182C-page 98
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
JEDEC Equivalent: MS-001
Drawing No. C04-007
*Controlling Parameter
Notes:
n
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
E1
E
eB
Dimension Limits
2
1
D
c
Units
A2
eB
A1
E1
B1
A
E
D
B
n
p
L
c
MIN
A1
A
.115
.015
.125
.045
.140
.300
.240
.890
.008
.014
.310
5
5
INCHES*
NOM
.100
.155
.130
.313
.250
.898
.130
.012
.058
.018
.370
18
10
10
B
B1
MAX
.170
.145
.325
.260
.905
.135
.015
.070
.022
.430
15
15
MIN
22.61
3.56
2.92
0.38
7.62
6.10
3.18
0.20
1.14
0.36
7.87
5
5
MILLIMETERS
NOM
p
1999 Microchip Technology Inc.
22.80
2.54
3.94
3.30
7.94
6.35
3.30
0.29
1.46
0.46
9.40
18
10
10
MAX
A2
L
22.99
10.92
4.32
3.68
8.26
6.60
3.43
0.38
1.78
0.56
15
15

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