DSPIC30F2010-30I/SO Microchip Technology, DSPIC30F2010-30I/SO Datasheet - Page 148

• Manufacturer Part Number: DSPIC30F2010-30I/SO
• Description: IC DSPIC MCU/DSP 12K 28SOIC
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F2010-30I/SO

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: I²C, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 20
• Program Memory Size: 12KB (4K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 1K x 8
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-SOIC (7.5mm Width)
• Core Frequency: 40MHz
• Core Supply Voltage: 5.5V
• Embedded Interface Type: I2C, SPI, UART
• No. Of I/o's: 20
• Flash Memory Size: 12KB
• Supply Voltage Range: 2.5V To 5.5V
• Package: 28SOIC W
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 30 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 20
• Interface Type: I2C/SPI/UART
• On-chip Adc: 6-chx10-bit
• Number Of Timers: 3
• Lead Free Status / RoHS Status: Request inventory verification / Request inventory verification

dsPIC30F2010
22.1
TABLE 22-1:
TABLE 22-2:
TABLE 22-3:
DS70118J-page 148
dsPIC30F2010-30I
dsPIC30F2010-20E
Power Dissipation:
Internal chip power dissipation:
I/O Pin power dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 28-pin SOIC (SO)
Package Thermal Resistance, 28-pin QFN
Package Thermal Resistance, 28-pin SPDIP (SP)
Note 1:
V
Operating Junction Temperature Range
Operating Junction Temperature Range
Operating Ambient Temperature Range
Operating Ambient Temperature Range
P
DC Characteristics
P
DD
4.5-5.5V
4.5-5.5V
3.0-3.6V
3.0-3.6V
2.5-3.0V
INT
I
Junction to ambient thermal resistance, Theta-ja (
/
O
=
Range
=
∑
V
(
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DD
{
V
×
DD
⎛
⎝
–
I
DD
V
Characteristic
OH
–
∑
} I
Rating
×
I
OH
OH
⎞
⎠
)
-40°C to 125°C
-40°C to 125°C
-40°C to 85°C
-40°C to 85°C
-40°C to 85°C
Temp Range
+
∑
(
V
O L
×
I
OL
)
θ
JA
dsPIC30F2010-30I
) numbers are achieved by package simulations.
Symbol
Symbol
P
DMAX
θ
θ
θ
P
T
T
T
T
30
20
10
—
—
JA
JA
JA
A
A
D
J
J
48.3
33.7
Min
Typ
-40
-40
-40
-40
42
Max MIPS
(T
© 2011 Microchip Technology Inc.
P
J
INT
- T
Max
Typ
—
—
—
—
—
—
—
+ P
A
dsPIC30F2010-20E
)/
θ
I
/
O
JA
°C/W
°C/W
°C/W
+125
+150
+125
Max
Unit
+85
20
15
—
—
—
Notes
Unit
°C
°C
°C
°C
W
W
1
1
1