PIC12F635-E/MF Microchip Technology, PIC12F635-E/MF Datasheet - Page 179
PIC12F635-E/MF
Manufacturer Part Number
PIC12F635-E/MF
Description
IC MCU FLASH 1KX14 8DFN
Manufacturer
Microchip Technology
Series
PIC® 12Fr
Specifications of PIC12F635-E/MF
Core Processor
PIC
Core Size
8-Bit
Speed
20MHz
Peripherals
Brown-out Detect/Reset, POR, WDT
Number Of I /o
5
Program Memory Size
1.75KB (1K x 14)
Program Memory Type
FLASH
Eeprom Size
128 x 8
Ram Size
64 x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.5 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
8-DFN
For Use With
AC164324 - MODULE SKT FOR MPLAB 8DFN/16QFNXLT08DFN2 - SOCKET TRANSITION ICE 14DIP/8DFNAC162057 - MPLAB ICD 2 HEADER 14DIPXLT08DFN - SOCKET TRANSITION ICE 8DFNAC164032 - ADAPTER PICSTART PLUS 8DFN/DIPAC124001 - MODULE SKT PROMATEII 8DIP/SOIC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Data Converters
-
Connectivity
-
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15.8
© 2007 Microchip Technology Inc.
Standard Operating Conditions (unless otherwise stated)
Operating temperature
TH01
TH02
TH03 T
TH04 PD
TH05 P
TH06 P
TH07 P
Note 1:
Para
No.
m
2:
3:
JA
JC
Thermal Considerations
J
INTERNAL
I
DER
/
O
Sym
I
T
Maximum allowable power dissipation is the lower value of either the absolute maximum total power
dissipation or derated power (P
DD
A
= Ambient Temperature.
is current to run the chip alone without driving any load on the output pins.
Thermal Resistance
Junction to Ambient
Thermal Resistance
Junction to Case
Junction Temperature
Power Dissipation
Internal Power Dissipation
I/O Power Dissipation
Derated Power
-40°C
Characteristic
T
A
+125°C
DER
).
PIC12F635
PIC16F636
PIC16F639 108.1
PIC12F635
PIC16F636
PIC16F639 32.2
PIC12F635/PIC16F636/639
163.0
100.4
84.6
52.4
52.4
69.8
85.0
46.3
41.2
38.8
32.5
31.0
31.7
Typ
150
3.0
3.0
2.6
—
—
—
—
Units
°C/W 8-pin PDIP package
°C/W 8-pin SOIC package
°C/W 8-pin DFN 4x4x0.9 mm package
°C/W 8-pin DFN-S 6x5 mm package
°C/W 14-pin PDIP package
°C/W 14-pin SOIC package
°C/W 14-pin TSSOP package
°C/W 16-pin QFN 4x0.9mm package
°C/W 20-pin SSOP package
°C/W 8-pin PDIP package
°C/W 8-pin SOIC package
°C/W 8-pin DFN 4x4x0.9 mm package
°C/W 8-pin DFN-S 6x5 mm package
°C/W 14-pin PDIP package
°C/W 14-pin SOIC package
°C/W 14-pin TSSOP package
°C/W 16-pin QFN 4x0.9mm package
°C/W 20-pin SSOP package
°C
W
W
W
W
For derated power calculations
PD = P
P
(NOTE 1)
P
P
(NOTE 2, 3)
INTERNAL
I
DER
/
O
=
= (T
INTERNAL
(I
OL
J
= I
- T
* V
DD
A
Conditions
)/
OL
+ P
x V
JA
) +
DD
I
/
O
DS41232D-page 177
(I
OH
* (V
DD
- V
OH
))
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