ADUC7024BST62-REEL Analog Devices Inc, ADUC7024BST62-REEL Datasheet - Page 93

• Manufacturer Part Number: ADUC7024BST62-REEL
• Description: IC MCU FLASH 62K W/ANLG 64-LQFP
• Manufacturer: Analog Devices Inc
• Series: MicroConverter® ADuC7xxxr

Specifications of ADUC7024BST62-REEL

• Rohs Status: RoHS non-compliant
• Design Resources: Sensing Low-g Acceleration Using ADXL345 Digital Accelerometer Connected to ADuC7024 (CN0133)
• Core Processor: ARM7
• Core Size: 16/32-Bit
• Speed: 44MHz
• Connectivity: EBI/EMI, I²C, SPI, UART/USART
• Peripherals: PLA, PWM, PSM, Temp Sensor, WDT
• Number Of I /o: 30
• Program Memory Size: 62KB (62K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 10x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 64-LQFP
• Eeprom Size: -
• Other names: ADUC7024BST62REEL

* 1.40 MAX
1.20 MAX
1.50
SQ
DETAIL A
BALL A1
INDICATOR
TOP VIEW
Figure 88. 64-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
DETAIL A
6.10
6.00 SQ
5.90
Figure. 49-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
BALL A1
PAD CORNER
TOP VIEW
5.05
5.00 SQ
4.95
* COMPLIANT TO JEDEC STANDARDS MO-225
WITH THE EXCEPTION TO PACKAGE HEIGHT.
Dimensions shown in millimeters
Dimensions shown in millimeters
Rev. C | Page 93 of 96
4.55 SQ
0.15 MIN
BSC SQ
3.90
(BC-64-4)
0.35
0.20
(BC-49-1)
BALL DIAMETER
0.65
BALL DIAMETER
7
BSC
0.65
8
ADuC7019/20/21/22/24/25/26/27/28/29
0.45
0.40
0.35
0.45
0.40
0.35
6
7
BOTTOM VIEW
DETAIL A
DETAIL A
5
BOTTOM
6
VIEW
4
5
INDEX AREA
A1 CORNER
INDEX AREA
4
3
A1 CORNER
SEATING
PLANE
3
2
2
SEATING
PLANE
1
BSC
0.55
1
A
B
C
D
E
F
G
B
D
E
F
H
1.00 MAX
0.85 MIN
A
C
G
0.65 MIN
COPLANARITY
0.05 MAX
COPLANARITY
0.10