EP7312-CB Cirrus Logic Inc, EP7312-CB Datasheet - Page 54

• Manufacturer Part Number: EP7312-CB
• Description: IC ARM720T MCU 74MHZ 256-PBGA
• Manufacturer: Cirrus Logic Inc
• Series: EP7r

Specifications of EP7312-CB

• Core Size: 32-Bit
• Core Processor: ARM7
• Speed: 74MHz
• Connectivity: Codec, DAI, EBI/EMI, IrDA, Keypad, SPI/Microwire1, UART/USART
• Peripherals: LCD, LED, MaverickKey, PWM
• Number Of I /o: 27
• Program Memory Type: ROMless
• Ram Size: 56K x 8
• Voltage - Supply (vcc/vdd): 2.3 V ~ 2.7 V
• Oscillator Type: External
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 256-BGA
• Controller Family/series: (ARM7)
• No. Of Timers 8/12/16/32 Bits: 0 / 0 / 2 / 0
• Interface: SSI, UART
• Embedded Interface Type: SSI, UART
• Mounting Type: Surface Mount
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• For Use With: 598-1209 - KIT DEVELOPMENT EP73XX ARM7
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant, Contains lead / RoHS non-compliant
• Other names: 598-1232

EP7312
High-Performance, Low-Power System on Chip
JTAG Boundary Scan Signal Ordering
54
Ball Location
*
†
‡ Input. Port A,B,D,E GPIOs default to input at nPOR and URESET conditions.
“With p/u” means with internal pull-up of 100 KOhms on the pin.
R10
R11
R12
R13
R14
R15
R16
Strength 2 = 12 ma
T10
T11
T12
T13
T14
T15
T16
Strength 1 = 4 ma
R5
R6
R7
R8
R9
T1
T2
T3
T4
T5
T6
T7
T8
T9
PD[7]/SDQM[1]
PD[6]/SDQM[0]
A[27]/DRA[0]
A[25]/DRA[2]
A[24]/DRA[3]
A[26]/DRA[1]
VDDCORE
SSIRXFR
SSITXDA
ADCOUT
DRIVE[0]
nADCCS
VDDRTC
SSICLK
VDDIO
COL[7]
COL[3]
COL[1]
VDDIO
COL[5]
VDDIO
VSSIO
Name
D[30]
PD[3]
FB[1]
D[28]
D[25]
BUZ
Pin No.
LQFP
1
4
5
6
7
Strength
TFBGA
Ball
B3
A2
B1
E3
C1
1
1
1
1
1
1
1
2
2
1
1
1
1
1
1
2
1
1
1
2
1
†
Table 22. 256-Ball PBGA Ball Listing (Continued)
Table 23. JTAG Boundary Scan Signal Ordering
Input
Input
Reset
High /
State
High
High
High
High
High
©
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
Low
PBGA
Ball
Copyright Cirrus Logic, Inc. 2005
B1
C2
E4
D1
F5
‡
‡
(All Rights Reserved)
Core power
Pad ground
RTC power
Pad power
Pad power
Pad power
Type
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
O
O
O
O
O
O
O
O
O
O
O
O
I
WRITE/nSDRAS
RUN/CLKEN
EXPCLK
Signal
nCS[5]
WORD
DAI/CODEC/SSI2 serial data output
SSI1 ADC chip select
Digital I/O power, 3.3V
SSI1 ADC serial data output
Keyboard scanner column drive
Keyboard scanner column drive
Keyboard scanner column drive
Data I/O
System byte address / SDRAM address
System byte address / SDRAM address
Digital I/O power, 3.3V
System byte address / SDRAM address
Real time clock power, 2.5V
GPIO port D / SDRAM byte lane mask
GPIO port D / SDRAM byte lane mask
GPIO port D
DAI/CODEC/SSI2 serial clock
DAI/CODEC/SSI2 frame sync
Core power, 2.5V
PWM drive output
PWM feedback input
Keyboard scanner column drive
Digital I/O power, 3.3V
Buzzer drive output
Data I/O
System byte address / SDRAM address
Data I/O
I/O ground
Type
I/O
O
O
O
O
Description
Position
10
1
3
6
8
DS508F1