CY8C26233-24PXI Cypress Semiconductor Corp, CY8C26233-24PXI Datasheet - Page 106
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CY8C26233-24PXI
Manufacturer Part Number
CY8C26233-24PXI
Description
IC MCU 8K FLASH 256B 20-DIP
Manufacturer
Cypress Semiconductor Corp
Series
PSOC™ CY8C26xxxr
Datasheet
1.CY8C25122-24PI.pdf
(148 pages)
Specifications of CY8C26233-24PXI
Core Processor
M8C
Core Size
8-Bit
Speed
24MHz
Connectivity
SPI, UART/USART
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
16
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.25 V
Data Converters
A/D 1x8b, 1x11b, 1x12b; D/A 1x9b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
20-DIP (0.300", 7.62mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Other names
428-1639
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
CY8C26233-24PXI
Manufacturer:
NXP
Quantity:
3 200
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Cypress MicroSystems CY8C25122/CY8C26233/CY8C26443/CY8C26643 Family Data Sheet
10.16 Temperature Sensing Capability
A temperature-sensitive voltage derived from the Band
Gap sensing on the die is buffered and available as an
analog input into the Analog Switch Cap Type A Block
ASA21. Temperature sensing allows protection of device
operating ranges for fail-safe applications. Temperature
sensing combined with a long sleep timer interval (to
allow the die to approximate ambient temperature) can
give an approximate ambient temperature for data acqui-
sition and battery charging applications. The user may
also calibrate the internal temperature rise based on a
known current consumption.
The temperature sensor input to the ASA21 block is
labeled VTemp, and its associated ground reference is
labeled TRefGND (see
FigureTitle
22,
FigureTitle
24).
106
Document #: 38-12010 CY Rev. ** CMS Rev. 3.20
September 5, 2002
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