ST7FMC2S6TC STMicroelectronics, ST7FMC2S6TC Datasheet - Page 289

IC MCU 8BIT 32K FLASH 44-LQFP

ST7FMC2S6TC

Manufacturer Part Number
ST7FMC2S6TC
Description
IC MCU 8BIT 32K FLASH 44-LQFP
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet

Specifications of ST7FMC2S6TC

Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
LINSCI, SPI
Peripherals
LVD, Motor Control PWM, POR, PWM, WDT
Number Of I /o
26
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3.8 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
External
Operating Temperature
-40°C ~ 125°C
Package / Case
44-LQFP
For Use With
497-8402 - BOARD EVAL COMPLETE INVERTER497-8400 - KIT IGBT PWR MODULE CTRL ST7MC497-6408 - BOARD EVAL BLDC SENSORLESS MOTOR497-4734 - EVAL KIT 3KW POWER DRIVER BOARD497-4733 - EVAL KIT 1KW POWER DRIVER BOARD497-4732 - EVAL KIT 300W POWER DRIVER BOARD497-4731 - EVAL KIT PWR DRIVER CONTROL BRD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ST7FMC2S6TC
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
ST7FMC2S6TCE
Manufacturer:
STMicroelectronics
Quantity:
10 000
13.3 SOLDERING INFORMATION
In accordance with the RoHS European directive,
all STMicroelectronics packages have been con-
verted to lead-free technology, named ECO-
PACK
Table 90. Soldering Compatibility (wave and reflow soldering process)
* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)
is compatible with their Lead-free soldering process.
SDIP & PDIP
LQFP and SO
ECOPACK
to the JEDEC STD-020C compliant soldering
profile.
Detailed information on the STMicroelectronics
ECOPACK
www.st.com/stonline/leadfree/,
technical Application notes covering the main
technical
conversion
AN2036).
Package
TM
.
TM
TM
aspects
(AN2033,
transition program is available on
packages are qualified according
Sn (pure Tin)
NiPdAu (Nickel-palladium-Gold)
related
Plating material devices
AN2034,
with
to
lead-free
AN2035,
specific
Backward and forward compatibility:
The main difference between Pb and Pb-free sol-
dering process is the temperature range.
– ECOPACK
– LQFP, SDIP and SO Pb-packages are compati-
are fully compatible with Lead (Pb) containing
soldering process (see application note AN2034)
ble with Lead-free soldering process, neverthe-
less it's the customer's duty to verify that the Pb-
packages maximum temperature (mentioned on
the Inner box label) is compatible with their Lead-
free soldering temperature.
Pb solder paste
Yes
Yes
TM
LQFP, SDIP and SO packages
ST7MC1xx/ST7MC2xx
Pb-free solder paste
Yes *
Yes *
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