MCP6G04-E/SL Microchip Technology, MCP6G04-E/SL Datasheet - Page 28

• Manufacturer Part Number: MCP6G04-E/SL
• Description: IC GAIN BLOCK 1.8V 4CH 14SOIC
• Manufacturer: Microchip Technology

Specifications of MCP6G04-E/SL

• Package / Case: 14-SOIC (3.9mm Width), 14-SOL
• Amplifier Type: General Purpose
• Number Of Circuits: 4
• Output Type: Rail-to-Rail
• Slew Rate: 4.5 V/µs
• -3db Bandwidth: 900kHz
• Current - Input Bias: 1pA
• Voltage - Input Offset: 1000µV
• Current - Supply: 110µA
• Current - Output / Channel: 20mA
• Voltage - Supply, Single/dual (±): 1.8 V ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Number Of Channels: 4
• Available Set Gain: 33.98 dB (Typ)
• Input Offset Voltage: 4.5 mV @ 5.5 V
• Input Bias Current (max): 0.000001 uA (Typ) @ 5.5 V
• Operating Supply Voltage: 3 V or 5 V
• Maximum Operating Temperature: + 125 C
• Minimum Operating Temperature: - 40 C
• Mounting Style: SMD/SMT
• Supply Voltage (max): 5.5 V
• Supply Voltage (min): 1.8 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Gain Bandwidth Product: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

MCP6G01/1R/1U/2/3/4
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
DS22004B-page 28
Note:
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
3. Dimensioning and tolerancing per ASME Y14.5M
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
NOTE 1
shall not exceed 0.15 mm per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
A
A1
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint
Foot Angle
Lead Thickness
Lead Width
N
1
2
b
D
e
Dimension Limits
E1
A2
Microchip Technology Drawing No. C04–111, Sept. 8, 2006
E
Units
c
A2
A1
E1
L1
N
A
E
D
ϕ
e
L
c
b
MIN
0.75
0.00
0.40
0.08
0.22
—
0°
MILLIMETERS
L1
0.65 BSC
4.90 BSC
3.00 BSC
3.00 BSC
0.95 REF
NOM
0.85
0.60
—
—
—
—
—
8
MAX
1.10
0.95
0.15
0.80
0.23
0.40
8°
© 2006 Microchip Technology Inc.
L
ϕ