OP292GSZ Analog Devices Inc, OP292GSZ Datasheet - Page 6

IC OPAMP GP 4MHZ DUAL 8SOIC

OP292GSZ

Manufacturer Part Number
OP292GSZ
Description
IC OPAMP GP 4MHZ DUAL 8SOIC
Manufacturer
Analog Devices Inc
Datasheets

Specifications of OP292GSZ

Slew Rate
4 V/µs
Amplifier Type
General Purpose
Number Of Circuits
2
Gain Bandwidth Product
4MHz
Current - Input Bias
375nA
Voltage - Input Offset
1000µV
Current - Supply
1mA
Current - Output / Channel
10.5mA
Voltage - Supply, Single/dual (±)
4.5 V ~ 33 V, ±2.25 V ~ 16.5 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Op Amp Type
General Purpose
No. Of Amplifiers
2
Bandwidth
4MHz
Supply Voltage Range
4.5V To 33V
Amplifier Case Style
SOIC
No. Of Pins
8
Channel Separation
100
Common Mode Rejection Ratio
95
Current, Input Bias
450 nA
Current, Input Offset
7 nA
Current, Output
8 mA
Current, Supply
0.8 mA
Impedance, Thermal
43 °C/W
Number Of Amplifiers
Dual
Package Type
SOIC-8
Temperature, Operating, Range
-40 to +125 °C
Voltage, Gain
200 V/mV
Voltage, Input
4 V
Voltage, Noise
15 nV/sqrt Hz
Voltage, Offset
0.1 mV
Voltage, Output, High
4.1 V
Voltage, Output, Low
280 mV
Voltage, Supply
5 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
-3db Bandwidth
-
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

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OP292/OP492
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Input Voltage Range
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature Range (Soldering, 60 sec)
1
For supply voltages less than 36 V, the absolute maximum input voltage is
equal to the supply voltage.
1
1
Rating
33 V
−15 V to +14 V
V
Unlimited
−65°C to +150°C
−40°C to +125°C
−65°C to +125°C
300°C
1
Rev. C | Page 6 of 20
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in the circuit board for the surface-mount packages.
Table 4. Thermal Resistance
Package Type
8-Lead SOIC
14-Lead SOIC
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
158
120
JA
θ
43
36
JC
Unit
°C/W
°C/W

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