AD8000YRDZ Analog Devices Inc, AD8000YRDZ Datasheet - Page 16

IC OPAMP CF LN 100MA 8SOIC

AD8000YRDZ

Manufacturer Part Number
AD8000YRDZ
Description
IC OPAMP CF LN 100MA 8SOIC
Manufacturer
Analog Devices Inc
Datasheet

Specifications of AD8000YRDZ

Slew Rate
4100 V/µs
Amplifier Type
Current Feedback
Number Of Circuits
1
-3db Bandwidth
1.58GHz
Current - Input Bias
5µA
Voltage - Input Offset
1000µV
Current - Supply
13.5mA
Current - Output / Channel
100mA
Voltage - Supply, Single/dual (±)
4.5 V ~ 12 V, ±2.25 V ~ 6 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width) Exposed Pad, 8-eSOIC. 8-HSOIC
Op Amp Type
High Speed
No. Of Amplifiers
1
Bandwidth
1.5GHz
Supply Voltage Range
4.5V To 12V
Amplifier Case Style
SOIC
No. Of Pins
8
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
Gain Bandwidth Product
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

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AD8000
Placement of the capacitor returns (grounds), where the capaci-
tors enter into the ground plane, is also important. Returning
the capacitors grounds close to the amplifier load is critical for
distortion performance. Keeping the capacitors distance short,
but equal from the load, is optimal for performance.
In some cases, bypassing between the two supplies can help to
improve PSRR and to maintain distortion performance in
crowded or difficult layouts. This is as another option to
improve performance.
Minimizing the trace length and widening the trace from the
capacitors to the amplifier reduce the trace inductance. A series
inductance with the parallel capacitance can form a tank circuit,
which can introduce high frequency ringing at the output. This
additional inductance can also contribute to increased distor-
tion due to high frequency compression at the output. The use
of vias should be minimized in the direct path to the amplifier
power supply pins since vias can introduce parasitic inductance,
which can lead to instability. When required, use multiple large
diameter vias because this lowers the equivalent parasitic
inductance.
Rev. A | Page 16 of 20
GROUNDING
The use of ground and power planes is encouraged as a method
of proving low impedance returns for power supply and signal
currents. Ground and power planes can also help to reduce
stray trace inductance and to provide a low thermal path for the
amplifier. Ground and power planes should not be used under
any of the pins of the AD8000. The mounting pads and the
ground or power planes can form a parasitic capacitance at the
amplifiers input. Stray capacitance on the inverting input and
the feedback resistor form a pole, which degrades the phase
margin, leading to instability. Excessive stray capacitance on the
output also forms a pole, which degrades phase margin.

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