AD823ANZ Analog Devices Inc, AD823ANZ Datasheet - Page 6

• Manufacturer Part Number: AD823ANZ
• Description: IC OPAMP JFET R-R DUAL LN 8DIP
• Manufacturer: Analog Devices Inc

Specifications of AD823ANZ

• Slew Rate: 25 V/µs
• Amplifier Type: J-FET
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• -3db Bandwidth: 16MHz
• Current - Input Bias: 5pA
• Voltage - Input Offset: 700µV
• Current - Supply: 7mA
• Current - Output / Channel: 17mA
• Voltage - Supply, Single/dual (±): 3 V ~ 36 V, ±1.5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Op Amp Type: Low Distortion
• No. Of Amplifiers: 2
• Bandwidth: 16MHz
• Supply Voltage Range: ± 1.5V To ± 18V
• Amplifier Case Style: DIP
• No. Of Pins: 8
• Common Mode Rejection Ratio: 82
• Current, Input Bias: 5 pA
• Current, Input Offset: 2 pA
• Current, Output: 17 mA
• Harmonic Distortion: -90 dBc
• Impedance, Thermal: 90 °C/W
• Number Of Amplifiers: Dual
• Package Type: PDIP-8
• Resistance, Input: 10^13 Ohms
• Temperature, Operating, Range: -40 to +85 °C
• Voltage, Input: -0.2 to +3.8 V (Common-Mode)
• Voltage, Noise: 16 nV/sqrt Hz
• Voltage, Offset: 0.7 mV
• Voltage, Output, High: +14.95 V
• Voltage, Output, Low: -14.95 V
• Voltage, Supply: ±15 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Gain Bandwidth Product: -
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

AD823
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Internal Power Dissipation
Input Voltage (Common Mode)
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range N, R
Operating Temperature Range
Lead Temperature Range
(Soldering, 10 sec)
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
PDIP (N)
SOIC (R)
Rating
36 V
1.3 W
0.9 W
±V
±V
See Figure 4
−65°C to +125°C
−40°C to +85°C
300°C
S
S
Rev. D | Page 6 of 20
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Specification is for device in free air.
Table 5. Thermal Resistance
Package Type
8-Lead PDIP
8-Lead SOIC
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
2.0
1.5
1.0
0.5
0
–50
Figure 4. Maximum Power Dissipation vs. Temperature
–40 –30 –20 –10 0
AMBIENT TEMPERATURE (°C)
8-LEAD PDIP
8-LEAD SOIC
10
20 30
θ
90
160
JA
40
50 60
T
J
70
= 150°C
Unit
°C/W
°C/W
80
90