OP284FSZ Analog Devices Inc, OP284FSZ Datasheet - Page 6

IC OPAMP GP R-R 4.25MHZ LN 8SOIC

OP284FSZ

Manufacturer Part Number
OP284FSZ
Description
IC OPAMP GP R-R 4.25MHZ LN 8SOIC
Manufacturer
Analog Devices Inc
Datasheets

Specifications of OP284FSZ

Slew Rate
4 V/µs
Amplifier Type
General Purpose
Number Of Circuits
2
Output Type
Rail-to-Rail
Gain Bandwidth Product
4.25MHz
Current - Input Bias
80nA
Voltage - Input Offset
175µV
Current - Supply
2.25mA
Current - Output / Channel
10mA
Voltage - Supply, Single/dual (±)
3 V ~ 36 V, ±1.5 V ~ 18 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Op Amp Type
Precision
No. Of Amplifiers
2
Bandwidth
4.25MHz
Supply Voltage Range
± 1.5V To ± 18V
Amplifier Case Style
SOIC
No. Of Pins
8
Common Mode Rejection Ratio
90
Current, Input Bias
80 nA
Current, Input Offset
50 nA
Current, Output
±10 mA
Current, Supply
2.25 mA
Impedance, Thermal
43 °C/W
Number Of Amplifiers
Dual
Package Type
SOIC-8
Temperature, Operating, Range
-40 to +125 °C
Voltage, Gain
1000 V/mV
Voltage, Input
-15 to +15 V
Voltage, Noise
3.9 nV/sqrt Hz
Voltage, Offset
250 μV
Voltage, Output, High
14.8 V
Voltage, Output, Low
-14.875 V
Voltage, Supply
±15 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
-3db Bandwidth
-
Lead Free Status / Rohs Status
RoHS Compliant part Electrostatic Device

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0
OP184/OP284/OP484
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Supply Voltage
Input Voltage
Differential Input Voltage
Output Short-Circuit Duration to GND
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply to both DICE and packaged
parts, unless otherwise noted.
For input voltages greater than 0.6 V, the input current should be limited to
less than 5 mA to prevent degradation or destruction of the input devices.
(Soldering 60 sec)
P-Suffix, S-Suffix Packages
OP184/OP284/OP484E/OP484F
P-Suffix, S-Suffix Packages
CB1
TP
M
JB1
N+
P+
QB1
RB1
QB2
1
–IN
JB2
Q1
R3
R1
Q3
RB2
QL1
QB3
QL2
−65°C to +150°C
−40°C to +125°C
−65°C to +150°C
Rating
±18 V
±18 V
±0.6 V
Indefinite
300°C
R4
Q4
QB6
Q2
R2
Figure 4. Simplified Schematic
+IN
QB4
QB5
Rev. I | Page 6 of 24
Q7
Q5
CC1
Q11
Q9
R5
THERMAL RESISTANCE
θ
for a device in socket for PDIP. θ
in the circuit board for SOIC packages.
Table 6. Thermal Resistance
Package Type
8-Lead PDIP (P-Suffix)
8-Lead SOIC (S-Suffix)
14-Lead PDIP (P-Suffix)
14-Lead SOIC (S-Suffix)
ESD CAUTION
JA
Q6
is specified for the worst-case conditions; that is, θ
QB7
Q8
Q12
Q10
R6
QB9
QB8
R7
RB3
C
FF
Q13
QB10
R8
RB4
Q14
CC2
R9
JA
θ
103
158
83
92
is specified for a device soldered
Q16
JA
Q15
R11
R10
C O
Q17
Q18
θ
43
43
39
27
JC
V
OUT
V
CC
EE
JA
is specified
Unit
°C/W
°C/W
°C/W
°C/W

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