OP467GPZ Analog Devices Inc, OP467GPZ Datasheet - Page 6

• Manufacturer Part Number: OP467GPZ
• Description: IC OPAMP GP 28MHZ QUAD 14DIP
• Manufacturer: Analog Devices Inc

Specifications of OP467GPZ

• Slew Rate: 350 V/µs
• Amplifier Type: General Purpose
• Number Of Circuits: 4
• Gain Bandwidth Product: 28MHz
• Current - Input Bias: 150nA
• Voltage - Input Offset: 200µV
• Current - Supply: 8mA
• Voltage - Supply, Single/dual (±): ±4.5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: 14-DIP (0.300", 7.62mm)
• Op Amp Type: High Speed
• No. Of Amplifiers: 4
• Bandwidth: 28MHz
• Supply Voltage Range: ± 4.5V To ± 18V
• Amplifier Case Style: DIP
• No. Of Pins: 14
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Output Type: -
• Current - Output / Channel: -
• -3db Bandwidth: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

OP467
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Input Voltage
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
Operating Temperature Range
Junction Temperature Range
Lead Temperature (Soldering, 60 sec)
1
2
Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
For supply voltages less than ±18 V, the absolute maximum input voltage is
equal to the supply voltage.
14-Lead CERDIP and 20-Terminal LCC
14-Lead PDIP and 16-Lead SOIC
OP467A
OP467G
14-Lead CERDIP and 20-Terminal LCC
14-Lead PDIP and 16-Lead SOIC
1
2
2
±18 V
Limited
Rating
±18 V
±26 V
−65°C to +175°C
−65°C to +150°C
−55°C to +125°C
−40°C to +85°C
−65°C to +175°C
−65°C to +150°C
300°C
Rev. | Page 6 o f 20
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 5.
Package Type
14-Lead CERDIP (Y)
14-Lead PDIP (P)
16-Lead SOIC (S)
20-Terminal LCC (RC)
1
in socket for CERDIP, PDIP, and LCC packages, and θ
soldered in circuit board for the SOIC package.
DICE CHARACTERISTICS
–IN A
+IN A
+IN B
–IN B
ESD CAUTION
θ
JA
JA
V+
is specified for the worst-case conditions, that is, a device
is specified for the worst-case conditions, that is, θ
2
3
4
5
6
Figure 5. 0.111 Inch × 0.100 Inch DIE Size, 11,100 sq. mils,
Substrate Connected to V+, 165 Transistors
1
7
θ
94
76
88
78
14
8
JA
1
θ
10
33
23
33
JA
JC
is specified for device
JA
is specified for device
Unit
°C/W
°C/W
°C/W
°C/W
13
12
11
10 +IN C
9
–IN D
+IN D
V–
–IN C