TSC101AILT STMicroelectronics, TSC101AILT Datasheet - Page 15

IC AMP HISIDE CURR SENSE SOT23-5

TSC101AILT

Manufacturer Part Number
TSC101AILT
Description
IC AMP HISIDE CURR SENSE SOT23-5
Manufacturer
STMicroelectronics
Datasheets

Specifications of TSC101AILT

Mfg Application Notes
TSC101 AppNote
Amplifier Type
Current Sense
Number Of Circuits
1
Slew Rate
0.9 V/µs
-3db Bandwidth
500kHz
Current - Input Bias
5.5µA
Voltage - Input Offset
200µV
Current - Supply
165µA
Current - Output / Channel
60mA
Voltage - Supply, Single/dual (±)
4 V ~ 24 V
Operating Temperature
-40°C ~ 125°C
Mounting Type
Surface Mount
Package / Case
SOT-23-5, SC-74A, SOT-25
Number Of Channels
Single
Common Mode Rejection Ratio (min)
90 dB
Available Set Gain
26.02 dB (Typ)
Input Offset Voltage
1.5 mV
Input Bias Current (max)
8 uA
Operating Supply Voltage
5 V, 9 V, 12 V, 15 V, 18 V
Supply Current
0.3 mA
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Voltage (max)
24 V
Supply Voltage (min)
4 V
No. Of Amplifiers
1
Input Bias Current
8µA
Output Current Per Channel
60mA
Gain Db Max
20dB
Bandwidth
500kHz
Cmrr
105dB
Supply Voltage Range
4V
Rohs Compliant
Yes
For Use With
497-8339 - BOARD EVAL BASED ON TSC101
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
Gain Bandwidth Product
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
497-6945-2
TSC101AILT

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TSC101AILT
Manufacturer:
ST
0
Part Number:
TSC101AILT
Manufacturer:
ST
Quantity:
20 000
TSC101
6
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
Figure 24. SOT23-5 package
Ref.
A1
A2
E1
e1
A
C
D
E
b
e
L
®
packages. These packages have a lead-free second level interconnect. The
Min.
0.90
0.00
0.90
0.35
0.09
2.80
2.60
1.50
0.35
Millimeters
Typ.
0.95
1.9
Max.
1.45
0.15
1.30
0.50
0.20
3.00
3.00
1.75
0.55
Dimensions
110.2
102.3
Min.
35.4
0.00
35.4
13.7
59.0
13.7
3.5
Package information
Typ.
Mils
37.4
74.8
118.1
118.1
Max.
57.1
51.2
19.7
68.8
21.6
5.9
7.8
15/17

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