TSV358IPT STMicroelectronics, TSV358IPT Datasheet - Page 9

• Manufacturer Part Number: TSV358IPT
• Description: IC OP AMP GP R-R I/O LP 8TSSOP
• Manufacturer: STMicroelectronics

Specifications of TSV358IPT

• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Slew Rate: 0.6 V/µs
• Gain Bandwidth Product: 1.4MHz
• Current - Input Bias: 70nA
• Voltage - Input Offset: 200µV
• Current - Supply: 500µA
• Current - Output / Channel: 80mA
• Voltage - Supply, Single/dual (±): 2.5 V ~ 6 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-TSSOP
• Number Of Channels: 2
• Voltage Gain Db: 92 dB
• Common Mode Rejection Ratio (min): 65 dB
• Input Offset Voltage: 3 mV
• Operating Supply Voltage: 3 V, 5 V
• Supply Current: 1.67 mA
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-4771-2

TSV321-TSV358-TSV324
3
3.1
Package information
In order to meet environmental requirements, STMicroelectronics offers these devices in
ECOPACK
category of second level interconnect is marked on the package and on the inner box label,
in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics
trademark. ECOPACK specifications are available at: www.st.com.
SOT23-5 package information
Figure 19. SOT23-5 package mechanical drawing
Table 5.
Ref.
A1
A2
E1
e1
A
C
D
E
b
e
L
®
packages. These packages have a lead-free second level interconnect. The
SOT23-5 package mechanical data
Min.
0.90
0.00
0.90
0.35
0.09
2.80
2.60
1.50
0.35
Millimeters
Typ.
0.95
1.9
Max.
1.45
0.15
1.30
0.50
0.20
3.00
3.00
1.75
0.55
Dimensions
110.2
102.3
Min.
35.4
0.00
35.4
13.7
59.0
13.7
3.5
Package information
Typ.
Mils
37.4
74.8
118.1
118.1
Max.
57.1
51.2
19.7
68.8
21.6
5.9
7.8
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