MC34074PG ON Semiconductor, MC34074PG Datasheet - Page 24

IC OPAMP QUAD SGL SUPP HS 14DIP

MC34074PG

Manufacturer Part Number
MC34074PG
Description
IC OPAMP QUAD SGL SUPP HS 14DIP
Manufacturer
ON Semiconductor
Datasheets

Specifications of MC34074PG

Amplifier Type
General Purpose
Number Of Circuits
4
Slew Rate
13 V/µs
Gain Bandwidth Product
4.5MHz
Current - Input Bias
100nA
Voltage - Input Offset
1000µV
Current - Supply
1.9mA
Current - Output / Channel
30mA
Voltage - Supply, Single/dual (±)
3 V ~ 44 V, ±1.5 V ~ 22 V
Operating Temperature
0°C ~ 70°C
Mounting Type
Through Hole
Package / Case
14-DIP (0.300", 7.62mm)
Number Of Channels
4
Common Mode Rejection Ratio (min)
70 dB
Input Voltage Range (max)
Positive Rail - 1.8 V
Input Voltage Range (min)
Negative Rail
Input Offset Voltage
5 mV
Input Bias Current (max)
500 nA
Operating Supply Voltage
44 V
Supply Current
7.6 mA
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Dual Supply Voltage
+/- 3 V, +/- 5 V, +/- 9 V
Maximum Dual Supply Voltage
+/- 22 V
Minimum Dual Supply Voltage
+/- 1.5 V
Mounting Style
Through Hole
Shutdown
No
Supply Voltage (max)
44 V
Supply Voltage (min)
3 V
Technology
Bipolar
Voltage Gain Db
100 dB
Bandwidth
4.5 MHz
Channel Separation
120
Common Mode Rejection Ratio
97
Current, Input Bias
700 nA
Current, Input Offset
300 nA
Current, Output
30 mA
Current, Supply
2.8 mA
Harmonic Distortion
0.02 %
Number Of Amplifiers
Quad
Package Type
PDIP-14
Resistance, Input
150 Megohms
Temperature, Operating, Range
0 to +70 °C
Voltage, Gain
20 V/mV
Voltage, Input
±15 V
Voltage, Noise
32 nV/sqrt Hz
Voltage, Offset
7 mV
Voltage, Output, High
13.4 V
Voltage, Output, Low
-13.5 V
Voltage, Supply
3 to 44 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Output Type
-
-3db Bandwidth
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MC34074PGOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC34074PG
Manufacturer:
MURATA
Quantity:
460
Part Number:
MC34074PG
Manufacturer:
ON
Quantity:
6 000
SEATING
PLANE
−T−
14
1
G
−A−
D
14 PL
0.25 (0.010)
M
*For additional information on our Pb−Free strategy and soldering
8
7
0.58
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−B−
14X
T
K
B
S
C
P
7 PL
A
SOLDERING FOOTPRINT*
S
0.25 (0.010)
PACKAGE DIMENSIONS
R
1
http://onsemi.com
X 45
CASE 751A−03
_
M
SOIC−14
ISSUE J
M
7.04
7X
B
24
M
DIMENSIONS: MILLIMETERS
J
1.52
14X
F
1.27
PITCH
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
5. DIMENSION D DOES NOT INCLUDE
ANSI Y14.5M, 1982.
MOLD PROTRUSION.
PER SIDE.
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
DIM
G
M
A
B
C
D
F
J
K
P
R
MILLIMETERS
MIN
8.55
3.80
1.35
0.35
0.40
0.19
0.10
5.80
0.25
1.27 BSC
0
_
MAX
8.75
4.00
1.75
0.49
1.25
0.25
0.25
6.20
0.50
7
_
0.337
0.150
0.054
0.014
0.016
0.008
0.004
0.228
0.010
MIN
0.050 BSC
0
INCHES
_
0.344
0.157
0.068
0.019
0.049
0.009
0.009
0.244
0.019
MAX
7
_

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