AD822ARMZ-REEL Analog Devices Inc, AD822ARMZ-REEL Datasheet - Page 10

• Manufacturer Part Number: AD822ARMZ-REEL
• Description: IC OPAMP GP R-R 1.9MHZ LP 8MSOP
• Manufacturer: Analog Devices Inc

Specifications of AD822ARMZ-REEL

• Slew Rate: 3 V/µs
• Design Resources: 16-Bit Fully Isolated 4 mA to 20 mA Output Module Using AD5662, ADuM1401, and External Amplifiers (CN0064)
• Amplifier Type: General Purpose
• Number Of Circuits: 2
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 1.9MHz
• -3db Bandwidth: 1.9MHz
• Current - Input Bias: 2pA
• Voltage - Input Offset: 400µV
• Current - Supply: 1.4mA
• Current - Output / Channel: 20mA
• Voltage - Supply, Single/dual (±): 3 V ~ 36 V, ±1.5 V ~ 18 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Op Amp Type: FET/JFET Input
• No. Of Amplifiers: 2
• Bandwidth: 1.8MHz
• Supply Voltage Range: ± 1.5V To ± 18V
• Amplifier Case Style: MSOP
• No. Of Pins: 8
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: AD822ARMZ-REELTR

AD822
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Internal Power Dissipation
Input Voltage
Output Short-Circuit Duration
Differential Input Voltage
Storage Temperature Range (N)
Storage Temperature Range (R, RM)
Operating Temperature Range
Lead Temperature
1
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
See the Input Characteristics section.
8-Lead PDIP (N)
8-Lead SOIC_N (R)
8-Lead MSOP (RM)
(Soldering, 60 sec)
A Grade and B Grade
1
Rating
±18 V
Observe derating curves
Observe derating curves
Observe derating curves
((V+) + 0.2 V) to
((V−) − 20 V)
Indefinite
±30 V
–65°C to +125°C
–65°C to +150°C
–40°C to +85°C
260°C
Rev. I | Page 10 of 24
THERMAL RESISTANCE
θ
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
8-lead PDIP (N)
8-lead SOIC_N (R)
8-lead MSOP (RM)
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD822 is limited by the associated rise in junction temperature.
For plastic packages, the maximum safe junction temperature is
145°C. If these maximums are exceeded momentarily, proper
circuit operation is restored as soon as the die temperature is
reduced. Leaving the device in the overheated condition for an
extended period can result in device burnout. To ensure proper
operation, it is important to observe the derating curves shown
in Figure 27.
While the AD822 is internally short-circuit protected, this may
not be sufficient to guarantee that the maximum junction
temperature is not exceeded under all conditions. With power
supplies ±12 V (or less) at an ambient temperature of 25°C or
less, if the output node is shorted to a supply rail, then the
amplifier is not destroyed, even if this condition persists for an
extended period.
ESD CAUTION
JA
is specified for the worst-case conditions, that is, a device
θ
90
160
190
JA
Unit
°C/W
°C/W
°C/W