MCP616-I/P Microchip Technology, MCP616-I/P Datasheet
MCP616-I/P
Specifications of MCP616-I/P
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MCP616-I/P Summary of contents
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... These features make this family of op amps well suited for battery- powered applications. The single MCP616, the single MCP618 with Chip Select (CS) and the dual MCP617 are all available in standard 8-lead PDIP, SOIC and MSOP packages. The quad MCP619 is offered in standard 14-lead PDIP, SOIC and TSSOP packages ...
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... MCP616/7/8/9 1.0 ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings † V – V .......................................................................7. All Inputs and Outputs ................... V – 0. Difference Input Voltage ...................................... |V Output Short Circuit Current ................................. Continuous Current at Input Pins ....................................................±2 mA Current at Output and Supply Pins ............................±30 mA Storage Temperature ....................................-65°C to +150°C Maximum Junction Temperature (T ) ......................... +150° ...
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... CSH I -2 -0.05 — µ — 10 — nA O(LEAK) t — 9 100 µ — 0.1 — µs OFF V — 0.6 — V HYST t OFF High-Z -50 nA (typ (typ.) MCP616/7/8/9 = 25° OUT DD Units Conditions kHz ° V/µs µ 0 P-P nV kHz fA kHz = 25° OUT DD Conditions ...
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... Thermal Resistance, 8L-MSOP Thermal Resistance, 14L-PDIP Thermal Resistance, 14L-SOIC Thermal Resistance, 14L-TSSOP Note 1: The MCP616/7/8/9 operate over this extended temperature range, but with reduced performance. In any case, the Junction Temperature (T ) must not exceed the Absolute Maximum specification of +150°C. J DS21613B-page 4 = +2.3V to +5.5V and V ...
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... FIGURE 2- 2.3V. DD 20% 600 Samples 18 16% 14% 12% 10 FIGURE 2- 5.5V. DD MCP616/7 OUT DD = 5.5V Input Offset Voltage Drift (µV/°C) Input Offset Voltage Drift at = 2.3V Input Offset Voltage Drift (µV/°C) Input Offset Voltage Drift at = 5.5V Input Offset Current (nA) Input Offset Current at DS21613B-page 5 ...
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... MCP616/7/8/9 Note: Unless otherwise indicated 100 and pF 150 Representative Part 100 2.3V DD -50 -100 -150 -50 - Ambient Temperature (°C) FIGURE 2-7: Input Offset Voltage vs. Ambient Temperature 5. 2. -50 - Ambient Temperature (°C) FIGURE 2-8: Quiescent Current vs. Ambient Temperature 5. 2. -50 - Ambient Temperature (°C) FIGURE 2-9: Maximum Output Voltage Swing vs ...
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... 0.25 40 0.20 30 0.15 20 0.10 10 0.05 0 0.00 -0.05 -10 -0.10 -20 -0.15 -30 -0.20 -40 -0.25 -0.30 -50 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 FIGURE 2-18: Output Voltage. MCP616/7 OUT DD 100 90 GBWP - 100 Ambient Temperature (°C) Gain Bandwidth Product +85° ...
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... MCP616/7/8/9 Note: Unless otherwise indicated 100 and pF +85° +25° -40° 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 Power Supply Voltage (V) FIGURE 2-19: Quiescent Current vs. Power Supply Voltage. 130 125 120 115 V DD 110 105 V DD ...
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... FIGURE 2-28: Frequency. 10,000 10 1,000 1 100 10 0.1 10k 100 1.E+02 4 FIGURE 2-29: Swing vs. Frequency. Gain = +1 FIGURE 2-30: Pulse Response. MCP616/7 OUT DD PSRR+ CMRR 1 10 100 1k 10k 1.E+00 1.E+01 1.E+02 1.E+03 1.E+04 Frequency (Hz) CMRR, PSRR vs 5. 2.3V ...
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... Time (5 µs/div) FIGURE 2-32: Chip Select (CS) to Amplifier Output Response Time (MCP618 only OUT -1 Time (100 µs/div) FIGURE 2-33: The MCP616/7/8/9 Show No Phase Reversal. DS21613B-page 10 = +2.3V to +5.5V GND 25° 5.0 Gain = +1 4 5.0V DD 4.0 3.5 3.0 2.5 2.0 1.5 1 ...
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... Typically, these parts are used in a single-supply (positive) configuration. In this case ground and V DD need a local bypass capacitor (typically 0.01 µF to 0.1 µF) within the V use a bulk capacitor (typically 1 µF or larger) within 100 mm of the V DD analog parts. MCP616/7/8/9 Description and 2.5V to 5.5V higher DD ). For normal SS and V ...
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... Input Current-Limiting Resistor ( DS21613B-page 12 4.2 DC Offsets The MCP616/7/8/9 family of op amps have a PNP input differential pair that gives good DC performance. They have very low input offset voltage (±150 µV, max +25°C, with a typical bias current of - (sourced out of the inputs). There must path to ground (or power supply) from both inputs, or the op amp will not bias properly ...
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... Rail-to-Rail Output There are two specifications that describe the output swing capability of the MCP616/7/8/9 family of op amps. The first specification (Maximum Output Voltage Swing) defines the absolute maximum swing that can be achieved under the specified load conditions. For instance, the output voltage swings to within ...
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... Under low humidity conditions, a typical resistance between nearby traces is 10 cause current to flow, which is greater than the MCP616/7/8/9 family’s bias current at 25°C (1 pA, typ.). The easiest way to reduce surface leakage is to use a guard ring around sensitive pins (or traces). The guard ring is biased at the same voltage as the sensitive pin ...
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... MCP616’s output from the load, increasing the high gain stage’s precision. Since the MCP606 has 1 a higher output current, and the two amplifiers are V housed in separate packages, there is minimal change OUT in the MCP616’s offset voltage due to loading effect. ½ MCP617 FIGURE 4-11: Load Isolation ...
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... Microchip provides the basic design tools needed for the MCP616/7/8/9 family of op amps. 5.1 SPICE Macro Model The latest SPICE macro model for the MCP616/7/8/9 op amps is available on Microchip’s web site at www.microchip.com. This model is intended initial design tool that works well in the op amp’s linear region of operation at room temperature ...
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... In the event the full Microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. © 2005 Microchip Technology Inc. MCP616/7/8/9 Examples: MCP616 MCP616 I/P ^^ 256 I/P256 0515 0515 Examples: MCP616I MCP616 SN^^ 0515 I/SN0515 256 256 Example: 616I 515256 ) e 3 DS21613B-page 17 ...
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... MCP616/7/8/9 Package Marking Information (Continued) 14-Lead PDIP (300 mil) (MCP619) XXXXXXXXXXXXXX XXXXXXXXXXXXXX YYWWNNN 14-Lead SOIC (150 mil) (MCP619) XXXXXXXXXX XXXXXXXXXX YYWWNNN 14-Lead TSSOP (MCP619) XXXXXXXX YYWW NNN DS21613B-page 18 Examples: MCP619-I/P XXXXXXXXXXXXXX OR 0515256 : Examples MCP619ISL XXXXXXXXXX OR 0515256 : Example MCP619IST 0515 256 MCP619 ...
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... B1 .045 .058 .070 B .014 .018 .022 § eB .310 .370 .430 MCP616/7/8 MILLIMETERS MIN NOM MAX 8 2.54 3.56 3.94 4.32 2.92 3.30 3.68 0.38 7.62 7.94 8.26 6.10 6.35 6.60 9.14 9.46 9.78 3.18 3.30 3.43 ...
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... MCP616/7/8/9 8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Overall Length Chamfer Distance Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top ...
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... L .016 .024 .031 F .037 REF 0° - 8° c .003 .006 .009 B .009 .012 .016 5° - 15° 5° - 15° MCP616/7/8/9 A2 MILLIMETERS* MIN NOM MAX 8 0.65 BSC - - 1.10 0.75 0.85 0.95 0.00 - 0.15 4.90 BSC 3.00 BSC 3.00 BSC 0.40 0.60 0.80 0.95 REF 0° ...
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... MCP616/7/8/9 14-Lead Plastic Dual In-line (P) – 300 mil (PDIP Dimension Limits Number of Pins Pitch Top to Seating Plane Molded Package Thickness Base to Seating Plane Shoulder to Shoulder Width Molded Package Width Overall Length Tip to Seating Plane Lead Thickness Upper Lead Width Lower Lead Width Overall Row Spacing § ...
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... L .016 .033 .050 .008 .009 .010 B .014 .017 .020 MCP616/7/8/9 A2 MILLIMETERS MIN NOM MAX 14 1.27 1.35 1.55 1.75 1.32 1.42 1.55 0.10 0.18 0.25 5.79 5.99 6.20 3.81 3.90 3.99 8.56 8.69 8.81 0.25 0.38 ...
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... MCP616/7/8/9 14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP Dimension Limits Number of Pins Pitch Overall Height Molded Package Thickness Standoff § Overall Width Molded Package Width Molded Package Length Foot Length Foot Angle Lead Thickness Lead Width Mold Draft Angle Top ...
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... Updated the SPICE macro model and added information on the FilterLab software, in Section 5.0 “Design Tools”. 6. Corrected package marking (Section 6.0 “Packaging Information”). 7. Added Appendix A: “Revision History”. Revision A (April 2001) • Original Release of this Document. © 2005 Microchip Technology Inc. information MCP616/7/8/9 DS21613B-page 25 ...
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... MCP616/7/8/9 NOTES: DS21613B-page 26 © 2005 Microchip Technology Inc. ...
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... Plastic DIP (300 mil Body), 8-lead, 14-lead SN = Plastic SOIC (150 mil Body), 8-lead SL = Plastic SOIC (150 mil Body), 14-lead (MCP619 Plastic TSSOP (4.4mm Body), 14-lead (MCP619) © 2005 Microchip Technology Inc. MCP616/7/8/9 . Examples: a) MCP616-I/P: Industrial Temperature, 8LD PDIP. b) MCP616-I/SN: Industrial Temperature, 8LD SOIC. c) MCP616T-I/SN: Tape and Reel, Industrial Temperature, 8LD SOIC ...
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... MCP616/7/8/9 NOTES: DS21613B-page 28 © 2005 Microchip Technology Inc. ...
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... PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel, Total Endurance and WiperLock are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. All other trademarks mentioned herein are property of their respective companies. ...
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... Fax: 65-6334-8850 Taiwan - Kaohsiung Tel: 886-7-536-4818 Fax: 886-7-536-4803 Taiwan - Taipei Tel: 886-2-2500-6610 Fax: 886-2-2508-0102 Taiwan - Hsinchu Tel: 886-3-572-9526 Fax: 886-3-572-6459 © 2005 Microchip Technology Inc. EUROPE Austria - Weis Tel: 43-7242-2244-399 Fax: 43-7242-2244-393 Denmark - Ballerup Tel: 45-4450-2828 Fax: 45-4485-2829 France - Massy Tel: 33-1-69-53-63-20 ...