MP103FC Cirrus Logic Inc, MP103FC Datasheet - Page 2

• Manufacturer Part Number: MP103FC
• Description: HIGH POWER AMP MODULE 65V/USSLEW
• Manufacturer: Cirrus Logic Inc
• Series: Apex Precision Power™r

Specifications of MP103FC

• Amplifier Type: Power
• Number Of Circuits: 2
• Slew Rate: 167 V/µs
• -3db Bandwidth: 230kHz
• Current - Input Bias: 3.3µA
• Voltage - Input Offset: 2000µV
• Current - Supply: 19mA
• Current - Output / Channel: 12A
• Voltage - Supply, Single/dual (±): 30 V ~ 200 V, ±15 V ~ 100 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 42-DIP Module
• Input Voltage Range (max): 200 V
• Input Voltage Range (min): 20 V
• Input Offset Voltage: 2 mV
• Output Current (typ): 15 A
• Supply Current: 1 mA
• Maximum Power Dissipation: 35 W
• Maximum Operating Temperature: + 70 C
• Minimum Operating Temperature: 0 C
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Output Type: -
• Gain Bandwidth Product: -
• Lead Free Status / Rohs Status: No
• Other names: 598-1794; MP103FC; Q4110212

© 2009 Cirrus Logic, Inc. All rights reserved. Cirrus Logic, Cirrus, the Cirrus Logic logo designs, Apex Precision Power, Apex and the Apex logo designs are
trademarks of Cirrus Logic, Inc. Other brand and product names may be trademarks or service marks of their respective owners.
www.cirrus.com
North America [phone]
Europe/UK [phone]
Asia Pacific [phone]
Toll-Free [phone]
[e-mail]
Japan [phone]
Austin, Texas 78746
teChniCAl suPPort
T [phone]
F [phone]
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[phone]
sAles suPPort
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United States
energy CoMPonents
Figure 2. The dual-channel MP103FC saves board space for inkjet printer applications that require up to 150 drive channels.
Key sPeCiFiCAtions
sAVe sPACe: oPen FrAMe heAt sinKing
AnD boArD Mounting
A heatsink can be flush mounted to the open frame mod-
ule above the board to free up board space. Components
can even be mounted on the board under the open frame,
as well as underneath the board.
the design and manufacturing of high power, precision
analog products for more than two decades. Many Apex
products have traditionally been designed as hybrids in
order to achieve voltage levels up to 1200V and 50A of
output current. Hybrids are known to be very reliable, but
also costly. To address this cost issue, Apex re-engineered
how a power component is designed and manufactured.
The Apex “open frame” product technology utilizes low
cost surface mount technology (SMT) to reduce per unit
costs by up to 75%.
Components can be mounted on
board under the open frame, as
well as underneath the board.
MP103FC
PA107DP
Model
Apex Precision Power has been an industry leader in
Slew Rate
3000 V/µs
180 Vµs
|
PA10 7 D P, M P10 3 F C
1.5 A Continuous, 5 A PEAK
Up to 15A PEAK X 2
Output Current
1/4-inch Spacing
Open Frame Unit
Supply Voltage Operation
40 V to 200 V Dual Supply
30 V to 200 V Dual Supply
thermal management by soldering unpackaged power
transistor die to a BeO (beryllia oxide) substrate which in
turn is soldered to a metal base package. In researching
lower cost alternatives, Apex design engineers discov-
ered how to create a package with a similarly low ther-
mal resistance at a significant cost savings by soldering
surface mount packaged power transistors to an insu-
lated metal substrate (IMS). An IMS substrate consists of
an aluminum metal substrate, a thin insulating layer and
a copper conductive layer. Overall the substrate is similar
to a standard printed circuit board but with far lower
thermal resistance.
significant cost efficiencies because they eliminate a
number of costly, time consuming manufacturing steps
typically found in the process intensive, labor intensive
assembly of hybrid components.
Traditional hybrid packages achieve exceptional
The use of SMT construction techniques generate
Product Bulletin 0236-0909-PB