MCP618-I/P Microchip Technology, MCP618-I/P Datasheet - Page 4

• Manufacturer Part Number: MCP618-I/P
• Description: IC OPAMP 2.3V R-R W/CS 8DIP
• Manufacturer: Microchip Technology

Specifications of MCP618-I/P

• Slew Rate: 0.08 V/µs
• Operating Temperature: -40°C ~ 85°C
• Amplifier Type: General Purpose
• Number Of Circuits: 1
• Output Type: Rail-to-Rail
• Gain Bandwidth Product: 190kHz
• Current - Input Bias: 15nA
• Voltage - Input Offset: 150µV
• Current - Supply: 19µA
• Current - Output / Channel: 17mA
• Voltage - Supply, Single/dual (±): 2.3 V ~ 5.5 V
• Mounting Type: Through Hole
• Package / Case: 8-DIP (0.300", 7.62mm)
• Op Amp Type: General Purpose
• No. Of Amplifiers: 1
• Bandwidth: 190kHz
• Supply Voltage Range: 2.3V To 5.5V
• Amplifier Case Style: DIP
• No. Of Pins: 8
• Number Of Channels: 1
• Voltage Gain Db: 120 dB
• Common Mode Rejection Ratio (min): 80 dB
• Input Offset Voltage: 0.15 mV
• Operating Supply Voltage: 3 V, 5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• -3db Bandwidth: -
• Lead Free Status / Rohs Status: Details

MCP616/7/8/9
TEMPERATURE CHARACTERISTICS
DS21613B-page 4
Electrical Specifications: Unless otherwise indicated, V
Temperature Ranges
Specified Temperature Range
Operating Temperature Range
Storage Temperature Range
Thermal Package Resistances
Thermal Resistance, 8L-PDIP
Thermal Resistance, 8L-SOIC
Thermal Resistance, 8L-MSOP
Thermal Resistance, 14L-PDIP
Thermal Resistance, 14L-SOIC
Thermal Resistance, 14L-TSSOP
Note 1:
Parameters
The MCP616/7/8/9 operate over this extended temperature range, but with reduced performance. In any case, the
Junction Temperature (T
J
) must not exceed the Absolute Maximum specification of +150°C.
Sym
T
T
T
JA
JA
JA
JA
JA
JA
A
A
A
Min
-40
-40
-65
—
—
—
—
—
—
DD
Typ
163
206
120
100
85
70
= +2.3V to +5.5V and V
—
—
—
Max
+125
+150
+85
—
—
—
—
—
—
Units
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C
°C
°C
SS
= GND.
Note 1
© 2005 Microchip Technology Inc.
Conditions