LT6001IMS8#PBF Linear Technology, LT6001IMS8#PBF Datasheet - Page 15
LT6001IMS8#PBF
Manufacturer Part Number
LT6001IMS8#PBF
Description
IC OP AMP DUAL R-R 8-MSOP
Manufacturer
Linear Technology
Datasheet
1.LT6000IDCBTRMPBF.pdf
(20 pages)
Specifications of LT6001IMS8#PBF
Amplifier Type
General Purpose
Number Of Circuits
2
Output Type
Rail-to-Rail
Slew Rate
0.018 V/µs
Gain Bandwidth Product
60kHz
Current - Input Bias
4nA
Voltage - Input Offset
400µV
Current - Supply
20µA
Current - Output / Channel
10mA
Voltage - Supply, Single/dual (±)
1.8 V ~ 16 V, ±0.9 V ~ 8 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
-3db Bandwidth
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
PACKAGE DESCRIPTIO
3.55 ±0.05
2.15 ±0.05
(SEE NOTE 6)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
PIN 1 BAR
1.65 ±0.05
(2 SIDES)
0.200 REF
U
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (TBD)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
2.00 ±0.10
1.35 ±0.05
(2 SIDES)
(2 SIDES)
6-Lead Plastic DFN (2mm × 3mm)
(Reference LTC DWG # 05-08-1715)
0.50 BSC
0.75 ±0.05
0.25 ± 0.05
DCB Package
0.70 ±0.05
3.00 ±0.10
(2 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
1.65 ± 0.10
R = 0.05
(2 SIDES)
TYP
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
LT6000/LT6001/LT6002
1.35 ±0.10
(2 SIDES)
3
4
6
1
0.50 BSC
0.40 ± 0.10
0.25 ± 0.05
PIN 1 NOTCH
R0.20 OR 0.25
× 45° CHAMFER
(DCB6) DFN 0405
15
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