LT6600CS8-10#TRPBF Linear Technology, LT6600CS8-10#TRPBF Datasheet - Page 12

• Manufacturer Part Number: LT6600CS8-10#TRPBF
• Description: IC AMP DIFF 10MHZ LP FLTR 8-SOIC
• Manufacturer: Linear Technology

Specifications of LT6600CS8-10#TRPBF

• Amplifier Type: Differential
• Number Of Circuits: 1
• Output Type: Differential
• Current - Input Bias: 40µA
• Voltage - Input Offset: 8000µV
• Current - Supply: 36mA
• Voltage - Supply, Single/dual (±): 3 V ~ 11 V, ±1.5 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output / Channel: -
• -3db Bandwidth: -
• Slew Rate: -
• Gain Bandwidth Product: -

APPLICATIONS INFORMATION
LT6600-10
Power Dissipation
The LT6600-10 amplifi ers combine high speed with
large-signal currents in a small package. There is a need
to ensure that the dies’s junction temperature does not
exceed 150°C. The LT6600-10 S8 package has Pin 6 fused
to the lead frame to enhance thermal conduction when
connecting to a ground plane or a large metal trace. Metal
trace and plated through-holes can be used to spread the
heat generated by the device to the backside of the PC
board. For example, on a 3/32" FR-4 board with 2oz copper,
a total of 660 square millimeters connected to Pin 6 of
the LT6600-10 S8 (330 square millimeters on each side
of the PC board) will result in a thermal resistance, θ
about 85°C/W. Without the extra metal trace connected to
the V
will be around 105°C/W. Table 2 can be used as a guide
when considering thermal resistance.
Table 2. LT6600-10 SO-8 Package Thermal Resistance
12
TOPSIDE
(mm
1100
330
35
35
COPPER AREA
0
–
2
)
pin to provide a heat sink, the thermal resistance
35
30
25
20
15
10
BACKSIDE
5
0
(mm
0.1
1100
330
35
SPECTRAL DENSITY
0
0
2
)
INTEGRATED
BOARD AREA
FREQUENCY (MHz)
1.0
NOISE
(mm
Figure 8
2500
2500
2500
2500
2500
2
)
10
(JUNCTION-TO-AMBIENT)
THERMAL RESISTANCE
6600 F08
100°C/W
105°C/W
100
65°C/W
85°C/W
95°C/W
140
120
100
80
60
40
20
0
JA
,of
Junction temperature, T
temperature, T
dissipation is the product of supply voltage, V
supply current, I
is given by:
where the supply current, I
impedance, temperature and common mode voltages.
For a given supply voltage, the worst-case power
dissipation occurs when the differential input signal is
maximum, the common mode currents are maximum
(see the Applications Information section regarding
common mode DC currents), the load impedance is
small and the ambient temperature is maximum. To
compute the junction temperature, measure the supply
current under these worst-case conditions, estimate the
thermal resistance from Table 2, then apply the equation
for T
DC differential input voltage of 250mV, a differential
output voltage of 1V, no load resistance and an ambient
temperature of 85°C, the supply current (current into V
measures 48.9mA. Assuming a PC board layout with a
35mm
junction temperature is:
When using higher supply voltages or when driving small
impedances, more copper may be necessary to keep T
below 150°C.
T
T
J
J
J
= T
= T
. For example, using the circuit in Figure 3 with
2
copper trace, the θ
A
A
+ (P
+ (P
D
D
A
, and power dissipation, P
• θ
• θ
S
. Therefore, the junction temperature
JA
JA
) = T
) = 85 + (5 • 0.0489 • 100) = 109°C
J
, is calculated from the ambient
S
A
, is a function of signal level, load
+ (V
JA
is 100°C/W. The resulting
S
• I
S
• θ
JA
)
D
. The power
S
, and
66001fd
+
)
J