LTC2053CMS8-SYNC#PBF Linear Technology, LTC2053CMS8-SYNC#PBF Datasheet - Page 15

• Manufacturer Part Number: LTC2053CMS8-SYNC#PBF
• Description: IC INSTRUMNT AMP R-RIN/OUT 8MSOP
• Manufacturer: Linear Technology

Specifications of LTC2053CMS8-SYNC#PBF

• Amplifier Type: Chopper (Zero-Drift)
• Number Of Circuits: 1
• Output Type: Rail-to-Rail
• Slew Rate: 0.2 V/µs
• Gain Bandwidth Product: 200kHz
• Current - Input Bias: 4nA
• Voltage - Input Offset: 5µV
• Current - Supply: 950µA
• Voltage - Supply, Single/dual (±): 2.7 V ~ 11 V, ±1.35 V ~ 5.5 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• No. Of Amplifiers: 1
• Input Offset Voltage: 20µV
• Bandwidth: 200kHz
• Amplifier Output: Single Ended
• Cmrr: 118dB
• Supply Voltage Range: 2.7V To ± 5.5V
• Supply Current: 950µA
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output / Channel: -
• -3db Bandwidth: -

package DescripTion
3.5 0.05
2.10 0.05
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
1.65 0.05
(2 SIDES)
(NOTE 6)
0.25 0.05
PIN 1
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
(Reference LTC DWG # 05-08-1698 Rev C)
2.38 0.05
8-Lead Plastic DFN (3mm × 3mm)
0.50
BSC
DD Package
0.75 0.05
3.00 0.10
0.70 0.05
(4 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
1.65 0.10
(2 SIDES)
LTC2053/LTC2053-SYNC
BOTTOM VIEW—EXPOSED PAD
0.25 0.05
R = 0.125
TYP
4
5
2.38 0.10
8
1
0.50 BSC
0.40 0.10
(DD8) DFN 0509 REV C

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