LT6600IS8-20#PBF Linear Technology, LT6600IS8-20#PBF Datasheet - Page 11

• Manufacturer Part Number: LT6600IS8-20#PBF
• Description: IC AMP DIFF LP FLTR 20MHZ 8-SOIC
• Manufacturer: Linear Technology

Specifications of LT6600IS8-20#PBF

• Amplifier Type: Differential
• Number Of Circuits: 1
• Output Type: Differential
• Current - Input Bias: 50µA
• Voltage - Input Offset: 10000µV
• Current - Supply: 46mA
• Voltage - Supply, Single/dual (±): 3 V ~ 11 V, ±1.5 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 8-SOIC (3.9mm Width)
• No. Of Amplifiers: 1
• Input Offset Voltage: 35mV
• Gain Db Max: 12.6dB
• Bandwidth: 20MHz
• Supply Voltage Range: 3V To 11V
• Supply Current: 42mA
• Amplifier Case Style: SOIC
• No. Of Pins: 8
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output / Channel: -
• -3db Bandwidth: -
• Slew Rate: -
• Gain Bandwidth Product: -

APPLICATIONS INFORMATION
Table 2. LT6600-20 SO-8 Package Thermal Resistance
Junction temperature, T
temperature, T
dissipation is the product of supply voltage, V
supply current, I
is given by:
where the supply current, I
impedance, temperature and common mode voltages.
PACKAGE DESCRIPTION
TOPSIDE
(mm
T
1100
330
J
35
35
COPPER AREA
0
= T
2
)
A
+ (P
BACKSIDE
(mm
1100
330
35
D
0
0
A
, and power dissipation, P
2
• θ
)
S
. Therefore, the junction temperature
JA
) = T
BOARD AREA
.030 ±.005
(mm
J
2500
2500
2500
2500
2500
, is calculated from the ambient
S
(0.203 – 0.254)
A
, is a function of signal level, load
.008 – .010
TYP
NOTE:
1. DIMENSIONS IN
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
+ (V
2
.245
MIN
RECOMMENDED SOLDER PAD LAYOUT
)
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
S
(0.254 – 0.508)
• I
.010 – .020
.050 BSC
(JUNCTION-TO-AMBIENT)
THERMAL RESISTANCE
S
• θ
(0.406 – 1.270)
8-Lead Plastic Small Outline (Narrow .150 Inch)
(MILLIMETERS)
.016 – .050
JA
INCHES
× 45°
100°C/W
105°C/W
65°C/W
85°C/W
95°C/W
)
D
. The power
(Reference LTC DWG # 05-08-1610)
.045 ±.005
.160 ±.005
S
, and
0°– 8° TYP
S8 Package
(5.791 – 6.197)
.228 – .244
For a given supply voltage, the worst-case power dissipation
occurs when the differential input signal is maximum, the
common mode currents are maximum (see the Applications
Information section regarding common mode DC currents),
the load impedance is small and the ambient temperature is
maximum. To compute the junction temperature, measure
the supply current under these worst-case conditions, es-
timate the thermal resistance from Table 2, then apply the
equation for T
with a DC differential input voltage of 250mV, a differential
output voltage of 1V, no load resistance and an ambient
temperature of 85°C, the supply current (current into Pin 3)
measures 55.5mA. Assuming a PC board layout with a
35mm
junction temperature is:
When using higher supply voltages or when driving small
impedances, more copper may be necessary to keep T
below 150°C.
(1.346 – 1.752)
(0.355 – 0.483)
.053 – .069
.014 – .019
T
TYP
J
= T
2
8
1
copper trace, the θ
A
+ (P
(4.801 – 5.004)
.189 – .197
7
2
NOTE 3
J
D
. For example, using the circuit in Figure 3
• θ
6
3
JA
5
4
) = 85 + (5 • 0.0555 • 100) = 113°C
(1.270)
.050
BSC
(3.810 – 3.988)
(0.101 – 0.254)
.150 – .157
.004 – .010
NOTE 3
JA
SO8 0303
is 100°C/W. The resulting
LT6600-20
11
66002fb
J